Numerical simulation of impedance discontinuities resulting from degradation of interconnections on printed circuit board
The study of Signal Integrity (SI) phenomena required the implementation of a specific test vehicle,...
The extraction of equivalents of lumped discontinuities in common printed circuit boards (PCBs) is ...
Traditional methods used to monitor interconnect reliability are based on measurement of dc resistan...
A 3-D model was developed for numerically simulating the effect of solder joint cracking on impedanc...
99 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.This dissertation focuses on t...
This paper presents RF impedance analysis as a nondestructive indicator of interconnect failure mech...
A method of modeling first-level metal interconnect signal transmission on silicon substrates with a...
A numerical procedure for the extraction of equivalent lumped circuits of printed circuit boards (PC...
The frequency-dependent characteristics of lossy interconnections such as on-chip metallization and ...
Abstract:- The development of integrated circuits has reached a situation today that the circuit ope...
Signal integrity (SI) issue is a critical concern as the data rate continues to increase and SI anal...
[[abstract]]A comprehensive system and method allow an integrated circuit designer to extract accura...
The development of lumped-element models for arbitrary microstripline discontinuities is described. ...
To process high-frequency signals on a printed circuit board (PCB), it is often necessary to careful...
185 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.The advent of fast devices an...
The study of Signal Integrity (SI) phenomena required the implementation of a specific test vehicle,...
The extraction of equivalents of lumped discontinuities in common printed circuit boards (PCBs) is ...
Traditional methods used to monitor interconnect reliability are based on measurement of dc resistan...
A 3-D model was developed for numerically simulating the effect of solder joint cracking on impedanc...
99 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.This dissertation focuses on t...
This paper presents RF impedance analysis as a nondestructive indicator of interconnect failure mech...
A method of modeling first-level metal interconnect signal transmission on silicon substrates with a...
A numerical procedure for the extraction of equivalent lumped circuits of printed circuit boards (PC...
The frequency-dependent characteristics of lossy interconnections such as on-chip metallization and ...
Abstract:- The development of integrated circuits has reached a situation today that the circuit ope...
Signal integrity (SI) issue is a critical concern as the data rate continues to increase and SI anal...
[[abstract]]A comprehensive system and method allow an integrated circuit designer to extract accura...
The development of lumped-element models for arbitrary microstripline discontinuities is described. ...
To process high-frequency signals on a printed circuit board (PCB), it is often necessary to careful...
185 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.The advent of fast devices an...
The study of Signal Integrity (SI) phenomena required the implementation of a specific test vehicle,...
The extraction of equivalents of lumped discontinuities in common printed circuit boards (PCBs) is ...
Traditional methods used to monitor interconnect reliability are based on measurement of dc resistan...