Electrochemical Deposition of Cobalt onto the Surface of Copper Using a Choline

This study involved the deposition of cobalt onto the surface of a copper substrate using a choline chloride-based ionic liquid. The solution used for electrodeposition contained a 2:1 molar ratio of ethylene glycol and choline chloride, with the dissolved CoCl2 to be deposited. Deposition was performed for 30min, with the solution kept at a constant temperature of 70C. The Co coating on the surface of the Cu substrate was clearly visible. The sample was analyzed using a Hirox optical microscope, which showed a clear difference between the Co coating and the uncoated side of the Cu substrate (Figure 1). Figure 1. Hirox image of the interface of the C