In this paper, results of mechanical strength investigations for glass frit bonded components using tensile and micro chevron testing are presented. Specific attention is given to the formation of lead precipitates close to the glass-silicon interface which affects the strength properties and form reliability risks. Results of the accompanying SEM and TEM investigations suggest that the lead precipitation can be understood in terms of a redox reaction involving the oxidation of the Si wafer and can be reduced by appropriate intermediate layers forming a barrier between glass and silicon
A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit ...
This study presents results of microstructure diagnostics and mechanical strength investigations for...
This paper gives an introduction to glass frit wafer bonding, which is an universally useable techno...
In this paper, results of mechanical strength investigations for glass frit bonded components using ...
Wafer bonding is a key technology in the manufacturing of microelectronic and micromechanical system...
Glass frit bonding is a widely used encapsulation technology for micro-electro mechanical systems. I...
On industrial scale, glass frit bonding is widely used for assembly and encapsulation of MEMS. A key...
Wafer bonding is a key technology in the manufacturing of micro electro mechanical systems (MEMS). I...
The glass frit layer in wafer-bonded MEMS is subjected to mechanical and thermo mechanical stresses ...
Frit glass bonding is a widely used technology for encapsulation of surface micro-machined structure...
The long-term mechanical stability of the wafer level package is an important aspect in the reliabil...
The hermetic package is one crucial element to ensure high reliability and lifetime of micro mechani...
In the thermo-compressive, silicon-to-silicon wafer bonding process, due to the residual stresses, t...
Abstract—The mechanical properties of miniaturized materials depend strongly on their structure, whi...
High reliability equipments are essential, especially in extreme environments. Extreme environment w...
A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit ...
This study presents results of microstructure diagnostics and mechanical strength investigations for...
This paper gives an introduction to glass frit wafer bonding, which is an universally useable techno...
In this paper, results of mechanical strength investigations for glass frit bonded components using ...
Wafer bonding is a key technology in the manufacturing of microelectronic and micromechanical system...
Glass frit bonding is a widely used encapsulation technology for micro-electro mechanical systems. I...
On industrial scale, glass frit bonding is widely used for assembly and encapsulation of MEMS. A key...
Wafer bonding is a key technology in the manufacturing of micro electro mechanical systems (MEMS). I...
The glass frit layer in wafer-bonded MEMS is subjected to mechanical and thermo mechanical stresses ...
Frit glass bonding is a widely used technology for encapsulation of surface micro-machined structure...
The long-term mechanical stability of the wafer level package is an important aspect in the reliabil...
The hermetic package is one crucial element to ensure high reliability and lifetime of micro mechani...
In the thermo-compressive, silicon-to-silicon wafer bonding process, due to the residual stresses, t...
Abstract—The mechanical properties of miniaturized materials depend strongly on their structure, whi...
High reliability equipments are essential, especially in extreme environments. Extreme environment w...
A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit ...
This study presents results of microstructure diagnostics and mechanical strength investigations for...
This paper gives an introduction to glass frit wafer bonding, which is an universally useable techno...
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