Add to ORKGA 3-D model was developed for numerically simulating the effect of solder joint cracking on impedance. Some initial re-flectometry results are reported of a microstrip transmission line as a crack propagates through a solder joint. Observations are made on the information obtained when using low-pass vs. band-pass modes for reconstructing reflectometry data from fre-quency domain results. A qualitative comparison is made with experimental results on samples with a design which is similar to the model. On the basis of these observations, approaches for improving the model and future applications are discussed
To process high-frequency signals on a printed circuit board (PCB), it is often necessary to careful...
The reliability of electronic assemblies is largely affected by the health of interconnects, such as...
This paper presents time-domain reflectometry (TDR) as a nondestructive sensing method for interconn...
Numerical simulation of impedance discontinuities resulting from degradation of interconnections on ...
This paper presents RF impedance analysis as a nondestructive indicator of interconnect failure mech...
The trend for many types of electronic products is toward higher operating frequencies or digital bi...
The trend for many types of electronic products is toward higher operating frequencies or digital bi...
Many types of electronic products are now operating at higher frequencies or digital bit rates. At h...
Traditional methods used to monitor interconnect reliability are based on measurement of dc resistan...
Measurements based on DC resistance have traditionally been used to monitor the reliability of elect...
Abstract — Many types of electronic products are now operating at higher frequencies or digital bit ...
High-speed PCB design for signal integrity (SI) is about feasible material selection, trace geometry...
For electronic products, interconnect failures may occur due to mechanisms such as fatigue, creep, c...
The microstrip transmission line numerical model is used to search out the relative permittivity and...
Electronic systems are exposed to a variety of environmen-tal impacts causing multiple degradations ...
To process high-frequency signals on a printed circuit board (PCB), it is often necessary to careful...
The reliability of electronic assemblies is largely affected by the health of interconnects, such as...
This paper presents time-domain reflectometry (TDR) as a nondestructive sensing method for interconn...
Numerical simulation of impedance discontinuities resulting from degradation of interconnections on ...
This paper presents RF impedance analysis as a nondestructive indicator of interconnect failure mech...
The trend for many types of electronic products is toward higher operating frequencies or digital bi...
The trend for many types of electronic products is toward higher operating frequencies or digital bi...
Many types of electronic products are now operating at higher frequencies or digital bit rates. At h...
Traditional methods used to monitor interconnect reliability are based on measurement of dc resistan...
Measurements based on DC resistance have traditionally been used to monitor the reliability of elect...
Abstract — Many types of electronic products are now operating at higher frequencies or digital bit ...
High-speed PCB design for signal integrity (SI) is about feasible material selection, trace geometry...
For electronic products, interconnect failures may occur due to mechanisms such as fatigue, creep, c...
The microstrip transmission line numerical model is used to search out the relative permittivity and...
Electronic systems are exposed to a variety of environmen-tal impacts causing multiple degradations ...
To process high-frequency signals on a printed circuit board (PCB), it is often necessary to careful...
The reliability of electronic assemblies is largely affected by the health of interconnects, such as...
This paper presents time-domain reflectometry (TDR) as a nondestructive sensing method for interconn...