Abstruct- NH3-nitridation to create nitrogen-rich layers in-between the stacked layers of the poly-Si gate for PMOS ap-plication is proposed and demonstrated. Due to the blocking of fluorine diffusion in the poly-Si gate by the nitrogen-rich layers, the amount of fluorine in the gate oxide, consequently, the fluorine enhancement on boron penetration is reduced. The negative effects of the NH3-nitridized oxide were not found in this work. Moreover, this nitridized stacked poly-Si gate improves significantly the electrical characteristics of the gate oxide as a result of the indirect and slight nitridation at the gate oxide. I
A novel technique of N2O treatment on NH3-nitrided oxide is used to prepare thin gate oxide. Experim...
[[abstract]]High-k gate dielectric process is the key technology for nano-scale MOS device. A nitrid...
immunity and a relatively heavy nitridation at the poly-Si/gate oxide inte tec sili thi
To suppress boron impurities' diffusion into channel, nitrogen implantation into polysilicon ga...
Abstract-A method of using a thin oxide on the top of the poly-Si gate to getter fluorine for BF; in...
PMOS devices with and without nitrogen implant into the gate electrode before doping with boron and ...
[[abstract]]The mechanism and the optimization of nitrogen implantation for suppression the boron pe...
Abstract- The post-polysilicon gate-process-induced degrada-tion on the underlying gate oxide is stu...
[[abstract]]The electrical reliability of gate oxynitride in metal-oxide-Si (MOS) capacitor can be c...
The effects of fluorine and nitrogen incorporation on ultra-thin gate oxide integrity (GOI) were inv...
Polysilicon (poly-Si) is mainly used as gate material for metal-oxide-semiconductor (MOS) based devi...
Effects of post polysilicon annealing (PPA) on silica gate oxide reliability were studied experiment...
The polycrystalline silicon thin film and gate oxide of poly-Si TFTs were treated by NH3/N2O plasma ...
This paper discusses boron doping using metal oxide semiconductor structure (poly-Si/SiOs/Si). The t...
\u3cp\u3eA technology for thin N\u3csub\u3e2\u3c/sub\u3eO nitrided gate oxide was developed for 0.25...
A novel technique of N2O treatment on NH3-nitrided oxide is used to prepare thin gate oxide. Experim...
[[abstract]]High-k gate dielectric process is the key technology for nano-scale MOS device. A nitrid...
immunity and a relatively heavy nitridation at the poly-Si/gate oxide inte tec sili thi
To suppress boron impurities' diffusion into channel, nitrogen implantation into polysilicon ga...
Abstract-A method of using a thin oxide on the top of the poly-Si gate to getter fluorine for BF; in...
PMOS devices with and without nitrogen implant into the gate electrode before doping with boron and ...
[[abstract]]The mechanism and the optimization of nitrogen implantation for suppression the boron pe...
Abstract- The post-polysilicon gate-process-induced degrada-tion on the underlying gate oxide is stu...
[[abstract]]The electrical reliability of gate oxynitride in metal-oxide-Si (MOS) capacitor can be c...
The effects of fluorine and nitrogen incorporation on ultra-thin gate oxide integrity (GOI) were inv...
Polysilicon (poly-Si) is mainly used as gate material for metal-oxide-semiconductor (MOS) based devi...
Effects of post polysilicon annealing (PPA) on silica gate oxide reliability were studied experiment...
The polycrystalline silicon thin film and gate oxide of poly-Si TFTs were treated by NH3/N2O plasma ...
This paper discusses boron doping using metal oxide semiconductor structure (poly-Si/SiOs/Si). The t...
\u3cp\u3eA technology for thin N\u3csub\u3e2\u3c/sub\u3eO nitrided gate oxide was developed for 0.25...
A novel technique of N2O treatment on NH3-nitrided oxide is used to prepare thin gate oxide. Experim...
[[abstract]]High-k gate dielectric process is the key technology for nano-scale MOS device. A nitrid...
immunity and a relatively heavy nitridation at the poly-Si/gate oxide inte tec sili thi