Open Access JECTC Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions

Copyright © 2013 Yasushi Koito, et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. A thermal via has been used to enhance the heat transfer through the printed circuit board (PCB). Because the thermal conductivity of a dielectric material is very low, the array of metal vias is placed to make thermal paths in the PCB. This paper describes the numerical analysis of the PCB having metal vias and focuses on the heat transfer characteris-tics under the nonisothermal boundary conditions. The mathematical model of the PCB has the metal vias between two metal sheets. Under 2nd and 3rd kinds of boundary conditions, the temperature distribution is obtained numerically by changing the design parameters. The discussion is also made on the effective thermal conductivity of the PCB. In in-dustry, the use of effective thermal conductivity is convenient for thermal engineers because it simplifies the calculation process, that is, the composite board can be modeled as a homogeneous medium. From the numerical results, it is con-firmed that the placement of metal sheets and the population of metal vias are important factors to dominate the heat transfer characteristics of the PCB. It is also shown that although the nonisothermal boundary conditions are applied at the boundary surface, the temperature difference between the heated and the cooled section is almost uniform when the metal vias are populated densely with the metal sheets. In this case, the effective thermal conductivity of the PCB i