This paper presents the results of 44 well known mem-ory tests applied to 1896 1M*4 DRAM chips, using up to 96 different stress combinations with each test. The results show the importance of selecting the right stress combina-tion, and that the theoretically better tests (i.e. those cov-ering more different functional faults) also have a higher fault coverage. However, the currently used fault models still leave much to be explained; e.g., the used data back-grounds and address orders show an unexplainable large variation in fault coverage. 1
Abstract: With the increasing complexity of memory behavior, attempts are being made to come up with...
Several recent publications confirm that faults are common in high-performance computing systems. Th...
In recent years, embedded memories are the fastest growing segment of system on chip. They therefore...
Abstract: DRAM testing has always been theoretically considered as a subset of general memory testin...
Abstract: Memory testing in general, and DRAM testing in particular, has become greatly dependent on...
The project examines the testing of the EPROM devices (on wafer) carried out in a local multinationa...
Dynamic random access memories (DRAMs) are the most widely used type of memory in the market today, ...
Since the minimum feature size of dynamic RAM has been scaled down, several studies have been carrie...
In this thesis, we study the problem of faults in modern semiconductor memory structures and their t...
Memory tests are applied in the industry using different algorithmic stresses (e.g., data-background...
ories is increasingly important b e cause of the high density of current memory chips (now 16 megabi...
As DRAM cells continue to shrink, they become more susceptible to retention failures. DRAM cells tha...
Abstract: Fabrication process improvements and technology scaling results in modifications in the ch...
In this work essential parts of a DRAM circuit are studied with respect to their transient behavior ...
Predict possible types of physical defects from electrical failure analysis using the Micromate test...
Abstract: With the increasing complexity of memory behavior, attempts are being made to come up with...
Several recent publications confirm that faults are common in high-performance computing systems. Th...
In recent years, embedded memories are the fastest growing segment of system on chip. They therefore...
Abstract: DRAM testing has always been theoretically considered as a subset of general memory testin...
Abstract: Memory testing in general, and DRAM testing in particular, has become greatly dependent on...
The project examines the testing of the EPROM devices (on wafer) carried out in a local multinationa...
Dynamic random access memories (DRAMs) are the most widely used type of memory in the market today, ...
Since the minimum feature size of dynamic RAM has been scaled down, several studies have been carrie...
In this thesis, we study the problem of faults in modern semiconductor memory structures and their t...
Memory tests are applied in the industry using different algorithmic stresses (e.g., data-background...
ories is increasingly important b e cause of the high density of current memory chips (now 16 megabi...
As DRAM cells continue to shrink, they become more susceptible to retention failures. DRAM cells tha...
Abstract: Fabrication process improvements and technology scaling results in modifications in the ch...
In this work essential parts of a DRAM circuit are studied with respect to their transient behavior ...
Predict possible types of physical defects from electrical failure analysis using the Micromate test...
Abstract: With the increasing complexity of memory behavior, attempts are being made to come up with...
Several recent publications confirm that faults are common in high-performance computing systems. Th...
In recent years, embedded memories are the fastest growing segment of system on chip. They therefore...