As technology scales down, coupling between nodes of the circuits increases and becomes an important factor in interconnection analysis. In many cases like the deep submicron technology (DSM), the coupling between lines (inter-wire capacitance) is strong and the power consumed by parasitic capacitance is non-negligible [1-6]. In this work, we employ the differential low-weight encoding [1] to reduce energy and delay (transmission cost) on DSM buses. We propose an enumeration method that reduces the encoder table-size from O(2n) words to O(n) words, for an n-bit DSM bus, and so reduces the memory complexity significantly and facilitates energy and delay reduction due to addressing and fetching data from large lookup tables. We modify the ene...
A data-distribution and bus-structure aware methodology for the design of coding schemes for low-pow...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
This book provides practical solutions for delay and power reduction for on-chip interconnects and b...
Interconnect analysis and optimization at high levels of abstraction is extremely attractive since i...
Abstract —Power consumption and delay are two of the most important constraints in current-day on-ch...
In this paper we present a simplified model for deep submicron, on-chip, parallel data buses. Using ...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
A data-distribution and bus-structure aware methodology for the design of coding schemes for low-pow...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
This book provides practical solutions for delay and power reduction for on-chip interconnects and b...
Interconnect analysis and optimization at high levels of abstraction is extremely attractive since i...
Abstract —Power consumption and delay are two of the most important constraints in current-day on-ch...
In this paper we present a simplified model for deep submicron, on-chip, parallel data buses. Using ...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
A data-distribution and bus-structure aware methodology for the design of coding schemes for low-pow...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...