Deposition of N-doped poly-Si films from SiH4 and NH3 using a single wafer type LPCVD system was investigated to improve the grain size reduction and the grain size distribution. The deposition rate and surface roughness of N-doped Si were greatly affected by the NH3/SiH4 ratio such that they decreased with increasing NH3/SiH4 ratio. XRD and TEM measurements revealed that with increasing NH3/SiH4 ratio, the size of the grains was decreased and the grains size distribution got uniform. Finally, we successfully obtained N-doped poly-Si films having uniform grain size belo
Scaling down of the CMOS technology requires thinner gate dielectric to maintain high performance. H...
The impact of the deposition parameters such as gas flow (sccm) and RF plasma power density (W/cm2) ...
International audienceThe paper deals with the properties of silicon films obtained by low-pressure ...
Polysilicon (poly-Si) is mainly used as gate material for metal-oxide-semiconductor (MOS) based devi...
International audienceIn this work we propose, the study of nitrogen doped Silicon films for an appl...
Nitrogen doped silicon (NIDOS) films have been deposited by low-pressure chemical vapor deposition f...
In double poly structures, the isolation between the two polysilicon films is achieved by oxidation ...
In this work we report on the effect of the substrate treatment on the grain size and the surface ro...
Deposition of polycrystalline silicon by thermolysis of silane, SiH₄, is a common technique for crea...
Highly conducting p- and n-type poly-Si:H films were deposited by hot wire chemical vapor deposition...
The use of low pressure chemical vapour deposition (LPCVD) for the growth of thin films of polysilic...
Abstract: We report in-situ doping of polysilicon grown on glass substrates by a LPCVD process. The ...
Low pressure chemically vapor deposited polysilicon deposition was studied from 525 to 650 ~ The sil...
Abstruct- NH3-nitridation to create nitrogen-rich layers in-between the stacked layers of the poly-S...
Low-pressure chemical vapour deposited (LPCVD) in situ phosphorus-doped polysilicon films have been ...
Scaling down of the CMOS technology requires thinner gate dielectric to maintain high performance. H...
The impact of the deposition parameters such as gas flow (sccm) and RF plasma power density (W/cm2) ...
International audienceThe paper deals with the properties of silicon films obtained by low-pressure ...
Polysilicon (poly-Si) is mainly used as gate material for metal-oxide-semiconductor (MOS) based devi...
International audienceIn this work we propose, the study of nitrogen doped Silicon films for an appl...
Nitrogen doped silicon (NIDOS) films have been deposited by low-pressure chemical vapor deposition f...
In double poly structures, the isolation between the two polysilicon films is achieved by oxidation ...
In this work we report on the effect of the substrate treatment on the grain size and the surface ro...
Deposition of polycrystalline silicon by thermolysis of silane, SiH₄, is a common technique for crea...
Highly conducting p- and n-type poly-Si:H films were deposited by hot wire chemical vapor deposition...
The use of low pressure chemical vapour deposition (LPCVD) for the growth of thin films of polysilic...
Abstract: We report in-situ doping of polysilicon grown on glass substrates by a LPCVD process. The ...
Low pressure chemically vapor deposited polysilicon deposition was studied from 525 to 650 ~ The sil...
Abstruct- NH3-nitridation to create nitrogen-rich layers in-between the stacked layers of the poly-S...
Low-pressure chemical vapour deposited (LPCVD) in situ phosphorus-doped polysilicon films have been ...
Scaling down of the CMOS technology requires thinner gate dielectric to maintain high performance. H...
The impact of the deposition parameters such as gas flow (sccm) and RF plasma power density (W/cm2) ...
International audienceThe paper deals with the properties of silicon films obtained by low-pressure ...