Single-event gate rupture (SEGR) continues to be a key failure mode in power MOSFETs. (1) SEGR is complex, making rate prediction difficult SEGR mechanism has two main components: (1) Oxide damage-- Reduces field required for rupture (2) Epilayer response -- Creates transient high field across the oxide
Abstract -An investigation into the failure rate of Power MOSFETs with room temperature junctions ha...
NASA Electronics Parts and Packaging program-funded activities over the past year on single-event ef...
We present an independent investigation of heavy-ion single event effect data for the Microsemi RTG4...
Almost every space mission uses vertical power metal-semiconductor-oxide field-effect transistors (M...
Single-event gate rupture (SEGR) is a potentially catastrophic failure mechanism of power MOSFETs bi...
Svnopsis: Power MOSFET devices are susceptible to heavy-ion induced Single-Event Gate Rupture. Compu...
Single Event Gate Rupture (SEGR) induced by an energetic ion traversing a MOSFET may cause catastrop...
Recent work for the NASA Electronic Parts and Packaging Program Power MOSFET task is presented. The ...
In this article, we investigate the Single Events Effects (SEE) leading to Single Event Burnout (SEB...
Radiation encountered in space environments can be damaging to microelectronics and potentially caus...
Gate oxide electric fields are expected to increase to greater than 5 MV/cm as feature size approach...
As integrated circuit densities increase with each new technology generation, both the lateral and v...
abstract: In recent years, the Silicon Super-Junction (SJ) power metal-oxide semiconductor field-eff...
Single event gate rupture (SEGR) is a catastrophic failure mode that occurs in dielectric materials ...
Eight commercially available n-channel power MOSFETs were exposed to high energy spallation neutrons...
Abstract -An investigation into the failure rate of Power MOSFETs with room temperature junctions ha...
NASA Electronics Parts and Packaging program-funded activities over the past year on single-event ef...
We present an independent investigation of heavy-ion single event effect data for the Microsemi RTG4...
Almost every space mission uses vertical power metal-semiconductor-oxide field-effect transistors (M...
Single-event gate rupture (SEGR) is a potentially catastrophic failure mechanism of power MOSFETs bi...
Svnopsis: Power MOSFET devices are susceptible to heavy-ion induced Single-Event Gate Rupture. Compu...
Single Event Gate Rupture (SEGR) induced by an energetic ion traversing a MOSFET may cause catastrop...
Recent work for the NASA Electronic Parts and Packaging Program Power MOSFET task is presented. The ...
In this article, we investigate the Single Events Effects (SEE) leading to Single Event Burnout (SEB...
Radiation encountered in space environments can be damaging to microelectronics and potentially caus...
Gate oxide electric fields are expected to increase to greater than 5 MV/cm as feature size approach...
As integrated circuit densities increase with each new technology generation, both the lateral and v...
abstract: In recent years, the Silicon Super-Junction (SJ) power metal-oxide semiconductor field-eff...
Single event gate rupture (SEGR) is a catastrophic failure mode that occurs in dielectric materials ...
Eight commercially available n-channel power MOSFETs were exposed to high energy spallation neutrons...
Abstract -An investigation into the failure rate of Power MOSFETs with room temperature junctions ha...
NASA Electronics Parts and Packaging program-funded activities over the past year on single-event ef...
We present an independent investigation of heavy-ion single event effect data for the Microsemi RTG4...