We investigated ZrO2-based new dielectric materials for random access memory by pulsed laser deposition (combi-PLD). We found that substitution of yttrium (Y) to ZrO2 system suppressed the leakage current effectively. MIM capacitor property of the promising composition candidates found in this system showed leakage current density less than 5×10-7 A/cm2 and the dielectric constant was 20. In addition, substitution of titanium (Ti) and tantalum (Ta) caused the dielectric constant up to ~ 22 within the allowed leakage level as well as 5×10-7 A/cm2. Zr-Y-Ti-O and Zr-Y-Ta-O system have a potential for high dielectric materials as a new material of DRAM capacitors instead of SiO2
The continuing drive towards miniaturization of electronic devices is motivating the search for new ...
As operating frequency and circuit density of VLSI systems continue to increase, the L*di/dt induced...
We report the room temperature fabrication of Ta/TiO2/Ta metal-insulator-metal (MIM) capacitors (mai...
ZrO2-based metal-insulator-metal capacitors are used in various volatile and nonvolatile memory devi...
Metal-insulator-metal (MIM) capacitors for DRAM applications have been realised using stacked TiO2-Z...
In this paper, the material and electrical properties of ZrO2 in metal-insulator-metal (MIM) DRAM ca...
A broad compositional range of the dielectric material Zr1-xHfxO2 was evaluated with respect to its ...
Low leakage current is mainly requirement of DRAM capacitor to following narrow scale down on semico...
Aiming for improvement of the ZrO2-based insulator properties as compared to the state-of-the-art Zr...
During DRAM capacitor scaling a lot of effort was spent searching for new material stacks to overcom...
We provide the first report of the structural and electrical properties of TiN/ZrO 2 /Ti/Al metal-in...
We provide the first report of the structural and electrical properties of TiN/ZrO2/Ti/Al metal-insu...
Metal-insulator-metal capacitors for dynamic random access memory applications have been realized us...
The continuous decreasing size of integrated circuits in the field of microelectronics is now applie...
The influence of oxidation pulse during atomic layer deposition (ALD) process on electrical and diel...
The continuing drive towards miniaturization of electronic devices is motivating the search for new ...
As operating frequency and circuit density of VLSI systems continue to increase, the L*di/dt induced...
We report the room temperature fabrication of Ta/TiO2/Ta metal-insulator-metal (MIM) capacitors (mai...
ZrO2-based metal-insulator-metal capacitors are used in various volatile and nonvolatile memory devi...
Metal-insulator-metal (MIM) capacitors for DRAM applications have been realised using stacked TiO2-Z...
In this paper, the material and electrical properties of ZrO2 in metal-insulator-metal (MIM) DRAM ca...
A broad compositional range of the dielectric material Zr1-xHfxO2 was evaluated with respect to its ...
Low leakage current is mainly requirement of DRAM capacitor to following narrow scale down on semico...
Aiming for improvement of the ZrO2-based insulator properties as compared to the state-of-the-art Zr...
During DRAM capacitor scaling a lot of effort was spent searching for new material stacks to overcom...
We provide the first report of the structural and electrical properties of TiN/ZrO 2 /Ti/Al metal-in...
We provide the first report of the structural and electrical properties of TiN/ZrO2/Ti/Al metal-insu...
Metal-insulator-metal capacitors for dynamic random access memory applications have been realized us...
The continuous decreasing size of integrated circuits in the field of microelectronics is now applie...
The influence of oxidation pulse during atomic layer deposition (ALD) process on electrical and diel...
The continuing drive towards miniaturization of electronic devices is motivating the search for new ...
As operating frequency and circuit density of VLSI systems continue to increase, the L*di/dt induced...
We report the room temperature fabrication of Ta/TiO2/Ta metal-insulator-metal (MIM) capacitors (mai...