Add to ORKGAbstract- The substrate coupling effects of two adjacent coplanar spiral inductors are characterized and modeled. The noise magnitude between two 45pm-away inductors can be reduced by 6.83 dB by using guard-ring surrounding each inductor, and improved by 10.28 dB further by adding patterned ground polysilicon shield beneath at 3 GHz. The inductor with patterned polysilicon shield beneath shows improved quality factor and noise isolation. Moreover, a macro model is presented for modeling quality factor and inductance of on-chip spiral inductor and associated neighboring inductor's coupling noise effect. I
This paper proposes a new differential topology that features a stacked multiloop inductor. Comparat...
Traditional noise immunity methodologies used in PCB designs are less effective when applied to RFIC...
The quality factor (Q) of two inductors for 5-60 GHz applications fabricated in an industrial back-e...
Recently, much studies have been done to include on-chip inductors for wireless communication IC des...
While previous studies [3] on substrate coupling focused mostly on noise induced through drain-bulk ...
This paper presents a novel on-chip inductor with a patterned ground shield inserted between the spi...
Recently, we have witnessed an increasing interest in integrating inductors in analog RF ICs to atta...
This paper presents a physics-based compact model for predicting high frequency performance of spira...
This paper describes a physical model for spiral inductors on silicon which is suitable for circuit ...
A physical-based analytical model for on-chip inductors is developed. A ladder structure is used to ...
Nowadays, as the demand for wireless communication continues to expand, the need for high quality (Q...
Abstract—The goal of this work was to simulate the effect of the finite conductivity of semiconducto...
[[abstract]]The impact of two different types of floating patterns on spiral inductors was investiga...
Abstract: As develops in deep sub-micron designs, the interconnect crosstalk becomes much more serio...
Modern RFICs have achieved an impressively high integration level, making cross-coupling effects amo...
This paper proposes a new differential topology that features a stacked multiloop inductor. Comparat...
Traditional noise immunity methodologies used in PCB designs are less effective when applied to RFIC...
The quality factor (Q) of two inductors for 5-60 GHz applications fabricated in an industrial back-e...
Recently, much studies have been done to include on-chip inductors for wireless communication IC des...
While previous studies [3] on substrate coupling focused mostly on noise induced through drain-bulk ...
This paper presents a novel on-chip inductor with a patterned ground shield inserted between the spi...
Recently, we have witnessed an increasing interest in integrating inductors in analog RF ICs to atta...
This paper presents a physics-based compact model for predicting high frequency performance of spira...
This paper describes a physical model for spiral inductors on silicon which is suitable for circuit ...
A physical-based analytical model for on-chip inductors is developed. A ladder structure is used to ...
Nowadays, as the demand for wireless communication continues to expand, the need for high quality (Q...
Abstract—The goal of this work was to simulate the effect of the finite conductivity of semiconducto...
[[abstract]]The impact of two different types of floating patterns on spiral inductors was investiga...
Abstract: As develops in deep sub-micron designs, the interconnect crosstalk becomes much more serio...
Modern RFICs have achieved an impressively high integration level, making cross-coupling effects amo...
This paper proposes a new differential topology that features a stacked multiloop inductor. Comparat...
Traditional noise immunity methodologies used in PCB designs are less effective when applied to RFIC...
The quality factor (Q) of two inductors for 5-60 GHz applications fabricated in an industrial back-e...