A Logarithmic Full-Chip Thermal Analysis Algorithm Based on Multi-Layer Green’s Function

This paper derives the multi-layer heat conduction Green’s function, by integrating the eigen-expansion tech-nique and the classic transmission line theories, and presents a logarithmic full-chip thermal analysis algo-rithm, which is verified by comparisons with a computa-tional fluid dynamics tool (FLUENT). The paper considers Dirichlet’s and general heat convection boundary con-ditions at chip surfaces. Experimental results show that the algorithm offers superior computing speed, com-pared to FLUENT and traditional Green’s function based methods. The paper also studies the limitations of the tra-ditional single-layer thermal model. 1