The successful use of the electrochemical process to produce compositional heterogeneous Co0 9Fe01(Cu) alloys is shown. Structure, composition, and morphology of the heterogeneous alloyed films, produced by the potentiostatic method, has been investigated by means of different techniques. Energy dispersive spectroscopy analyses reveal that the total amount of Co and Fe in the electrodeposits is strongly dependent on the Cu concentration in the plating solution at the potentiodynamic range investigated. The Co:Fe ratio does not change drastically due to Cu incorporation in the elec— trodeposits. It was also observed that by increasing the Cu content in the electrodeposits a granular morphologyis obtained. Transmission electron microscopy was...
Ternary Co-Fe-Cu thin films with 78.5–92.4 at.% Co, 4.1–17.9 at.% Fe, and 3.1–3.6 at.% Cu were electr...
Ni-Co alloy deposits and their parent metals were formed on Cu substrates by electrolysis under diff...
Cu-Ag alloys are promising materials for electrical interconnections due to their combination of hig...
Co–Fe films are grown onto plane pre-treated Cu foils; the effects of the alloy composition on the m...
Granular thin-films of the alloy Cu100-xCox within the composition range 6<x<35 have been gr...
The structural and magnetic properties of Co-Cu films were studied in terms of Co content in the fil...
The nickel and cobalt disperse alloy deposits of five different compositions were obtained by electr...
Structural and magnetic properties of CoCu films electrodeposited on polycrystalline Cu substrates w...
The microstructural and magnetic properties of Fe-Cu films were studied in terms of Cu content in th...
Fe-Cu alloys were grown on polycrystalline titanium substrates after determining the suitable deposi...
CoxCu1−x alloy lms were prepared by using electrodeposition technique. The variations of Co and Cu c...
In a previous work [El-Tahawy et al., J. Magn. Magn. Mater. 560, 169660 (2022)], we reported that fr...
Fe-Cu alloys were grown on polycrystalline titanium substrates after determining the suitable depos...
In this present work, cobalt-iron, cobalt-platinum, iron-platinum and cobalt-iron-platinum systems w...
In this paper, the morphology and phase structure of Ni-Co powders electrodeposited from ammoniacal ...
Ternary Co-Fe-Cu thin films with 78.5–92.4 at.% Co, 4.1–17.9 at.% Fe, and 3.1–3.6 at.% Cu were electr...
Ni-Co alloy deposits and their parent metals were formed on Cu substrates by electrolysis under diff...
Cu-Ag alloys are promising materials for electrical interconnections due to their combination of hig...
Co–Fe films are grown onto plane pre-treated Cu foils; the effects of the alloy composition on the m...
Granular thin-films of the alloy Cu100-xCox within the composition range 6<x<35 have been gr...
The structural and magnetic properties of Co-Cu films were studied in terms of Co content in the fil...
The nickel and cobalt disperse alloy deposits of five different compositions were obtained by electr...
Structural and magnetic properties of CoCu films electrodeposited on polycrystalline Cu substrates w...
The microstructural and magnetic properties of Fe-Cu films were studied in terms of Cu content in th...
Fe-Cu alloys were grown on polycrystalline titanium substrates after determining the suitable deposi...
CoxCu1−x alloy lms were prepared by using electrodeposition technique. The variations of Co and Cu c...
In a previous work [El-Tahawy et al., J. Magn. Magn. Mater. 560, 169660 (2022)], we reported that fr...
Fe-Cu alloys were grown on polycrystalline titanium substrates after determining the suitable depos...
In this present work, cobalt-iron, cobalt-platinum, iron-platinum and cobalt-iron-platinum systems w...
In this paper, the morphology and phase structure of Ni-Co powders electrodeposited from ammoniacal ...
Ternary Co-Fe-Cu thin films with 78.5–92.4 at.% Co, 4.1–17.9 at.% Fe, and 3.1–3.6 at.% Cu were electr...
Ni-Co alloy deposits and their parent metals were formed on Cu substrates by electrolysis under diff...
Cu-Ag alloys are promising materials for electrical interconnections due to their combination of hig...