Abstract—In this work, using 3D device simulation, we perform an extensive gate to source/drain underlap optimization for the recently proposed hybrid transistor, HFinFET, to show that the underlap lengths can be suitably tuned to improve the on-off ratio as well as the subthreshold characteristics in an ultra-short channel n-type device without significant on performance degradation. We also show that the underlap knob can be tuned to mitigate the device quality degradation in presence of interface traps. The obtained results are shown to be very promising when compared against ITRS 2009 performance projections as well as published state of the art planar and non-planar Silicon MOSFET data of comparable gate lengths using standard benchmar...
Abstract—In the present work a methodology to minimize short channel effects (SCEs) by modulating th...
Sub-10nm gate length transistors have severe short channel effects along with new leakage mechanisms...
As the device size shrinks continuously by scaling in the current Si CMOS technology, the drain indu...
In this work, using 3-D device simulation, we perform an extensive gate to source/drain underlap opt...
Leakage currents in CMOS transistors have risen dramatically with technology scaling leading to sign...
The difficulty to fabricate and control precisely defined doping profiles in the source/drain underl...
In this letter, we propose the design and simulation study of a novel transistor, called HFinFET, wh...
DoctorI present numerical simulation results and physical analysis of the electrical characteristics...
Ultrathin body MOSFETs are suitable in sub-50nm technologies due to their excellent immunity to shor...
AbstractFrom the commencement of CMOS scaling, the simple MOSFETs are not up to the performance due ...
The effect of gate length 8 nm with underlap of double gate MOSFET has been designed for VLSI Techno...
Sub-20 nm gate length FinFETs, are constrained by the very thin fin thickness (TFIN) necessary to ma...
478-485This paper investigates a hetero-junction vertical t-shape tunnel field effect transistor and...
Due to the increasing need for low-power circuits in mobile applications, numerous leakage and perfo...
© 2021 IEEE. The effect of gate length 8 nm with underlap of double-gate MOSFET has been designed fo...
Abstract—In the present work a methodology to minimize short channel effects (SCEs) by modulating th...
Sub-10nm gate length transistors have severe short channel effects along with new leakage mechanisms...
As the device size shrinks continuously by scaling in the current Si CMOS technology, the drain indu...
In this work, using 3-D device simulation, we perform an extensive gate to source/drain underlap opt...
Leakage currents in CMOS transistors have risen dramatically with technology scaling leading to sign...
The difficulty to fabricate and control precisely defined doping profiles in the source/drain underl...
In this letter, we propose the design and simulation study of a novel transistor, called HFinFET, wh...
DoctorI present numerical simulation results and physical analysis of the electrical characteristics...
Ultrathin body MOSFETs are suitable in sub-50nm technologies due to their excellent immunity to shor...
AbstractFrom the commencement of CMOS scaling, the simple MOSFETs are not up to the performance due ...
The effect of gate length 8 nm with underlap of double gate MOSFET has been designed for VLSI Techno...
Sub-20 nm gate length FinFETs, are constrained by the very thin fin thickness (TFIN) necessary to ma...
478-485This paper investigates a hetero-junction vertical t-shape tunnel field effect transistor and...
Due to the increasing need for low-power circuits in mobile applications, numerous leakage and perfo...
© 2021 IEEE. The effect of gate length 8 nm with underlap of double-gate MOSFET has been designed fo...
Abstract—In the present work a methodology to minimize short channel effects (SCEs) by modulating th...
Sub-10nm gate length transistors have severe short channel effects along with new leakage mechanisms...
As the device size shrinks continuously by scaling in the current Si CMOS technology, the drain indu...