As CMOS technology scales down towards nanometer regime and the supply voltage approaches the threshold voltage, increase in operating temperature results in increased cir-cuit current, which in turn reduces circuit propagation de-lay. This paper exploits this new phenomenon, known as inverse thermal dependence (ITD) for power, performance, and temperature optimization in processor architecture. ITD changes the maximum achievable operating frequency of the processor at high temperatures. Dynamic thermal manage-ment techniques such as activity migration, dynamic volt-age frequency scaling, and throttling are revisited in this paper, with a focus on the effect of ITD. Results are ob-tained using the predictive technology models of 7nm, 10nm 1...
The continued scaling of semiconductor technologies leads to diverse challenges such as power and te...
Traditionally, the effects of temperature on delay of CMOS devices have been evaluated using the hig...
Temperature dependent propagation delay characteristics of CMOS circuits will expe-rience a complete...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
With the increasing clock rate and transistor count of to-day’s microprocessors, power dissipation i...
Higher die temperature due to increasing power density pose a major reliability concern in present-d...
With the continuous downscaling of semiconductor processes, the growing power density and thermal is...
When considering modern ICs mapped onto nanometer CMOS technologies, increasingly higher power densi...
Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cool...
Catering to society\u27s demand for high performance computing, billions of transistors are now inte...
When an application or external environmental condi-tions cause a chip’s cooling capacity to be exce...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
Energy consumption has become one of the main design constraints in today’s integrated circuits. Tec...
With chip temperature being a major hurdle in microprocessor design, techniques to recover the perfo...
The continued scaling of semiconductor technologies leads to diverse challenges such as power and te...
Traditionally, the effects of temperature on delay of CMOS devices have been evaluated using the hig...
Temperature dependent propagation delay characteristics of CMOS circuits will expe-rience a complete...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
With the increasing clock rate and transistor count of to-day’s microprocessors, power dissipation i...
Higher die temperature due to increasing power density pose a major reliability concern in present-d...
With the continuous downscaling of semiconductor processes, the growing power density and thermal is...
When considering modern ICs mapped onto nanometer CMOS technologies, increasingly higher power densi...
Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cool...
Catering to society\u27s demand for high performance computing, billions of transistors are now inte...
When an application or external environmental condi-tions cause a chip’s cooling capacity to be exce...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
Energy consumption has become one of the main design constraints in today’s integrated circuits. Tec...
With chip temperature being a major hurdle in microprocessor design, techniques to recover the perfo...
The continued scaling of semiconductor technologies leads to diverse challenges such as power and te...
Traditionally, the effects of temperature on delay of CMOS devices have been evaluated using the hig...
Temperature dependent propagation delay characteristics of CMOS circuits will expe-rience a complete...