Abstract—Recent technology advancements allow for the integration of large memory structures on-die or as a die-stacked DRAM. Such structures provide higher bandwidth and faster access time than off-chip memory. Prior work has investigated using the large integrated memory as a cache, or using it as part of a heterogeneous memory system under management of the OS. Using this memory as a cache would waste a large fraction of total memory space, especially for the systems where stacked memory could be as large as off-chip memory. An OS-managed heterogeneous memory system, on the other hand, requires costly usage-monitoring hardware to migrate frequently-used pages, and is often unable to capture pages that are highly utilized for short period...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
Hybrid main memories composed of DRAM as a cache to scalable non-volatile memories such as phase-cha...
Abstract. The memory wall (the gap between processing and storage speeds) remains a concern to compu...
the tight integration of significant quantities of DRAM with high-performance computation logic. How...
Abstract—This paper analyzes the trade-offs in architecting stacked DRAM either as part of main memo...
As device technologies scale in the nanometer era, the current off-chip DRAM technologies are very c...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
This paper presents an operating system managed die-stacked DRAM called i-MIRROR that mirrors high l...
Stacked DRAM memories have become a reality in High-Performance Computing (HPC) architectures. These...
Performance-hungry data center applications demand increasingly higher performance from their storag...
Abstract—This paper presents an innovative memory management approach to utilize both 3D-DRAM and ex...
Recently, high-speed non-volatile storage technologies such as PCM (Phase Change Memory) emerge and ...
The memory system is a major bottleneck in achieving high performance and energy efficiency for vari...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
Large, multi-terabyte main memories per processor socket are instrumental to address\ua0the continuo...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
Hybrid main memories composed of DRAM as a cache to scalable non-volatile memories such as phase-cha...
Abstract. The memory wall (the gap between processing and storage speeds) remains a concern to compu...
the tight integration of significant quantities of DRAM with high-performance computation logic. How...
Abstract—This paper analyzes the trade-offs in architecting stacked DRAM either as part of main memo...
As device technologies scale in the nanometer era, the current off-chip DRAM technologies are very c...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
This paper presents an operating system managed die-stacked DRAM called i-MIRROR that mirrors high l...
Stacked DRAM memories have become a reality in High-Performance Computing (HPC) architectures. These...
Performance-hungry data center applications demand increasingly higher performance from their storag...
Abstract—This paper presents an innovative memory management approach to utilize both 3D-DRAM and ex...
Recently, high-speed non-volatile storage technologies such as PCM (Phase Change Memory) emerge and ...
The memory system is a major bottleneck in achieving high performance and energy efficiency for vari...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
Large, multi-terabyte main memories per processor socket are instrumental to address\ua0the continuo...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
Hybrid main memories composed of DRAM as a cache to scalable non-volatile memories such as phase-cha...
Abstract. The memory wall (the gap between processing and storage speeds) remains a concern to compu...