3D Packaging Technology for Portable Systems D Abbott.

This paper reviews the state-of-the-art in VLSI 3D packaging technology with a view to compact portable electronic systems. A number of bare dice and MGM stacking technologies are now emerging to meet the eúer increasing demands for low power consumption, low weight and compact portable systems. Technical issues such as silicon efficiency, complexity, thermal management, interconnection capacity, speed and power are shown to be critical in the choice of 3D stacking technology, depending on the target application.