In this paper we propose an analytical technique for the steady-state dynamic temperature analysis (SSDTA) of mul-tiprocessor systems with periodic applications. The approach is accurate and, moreover, fast, such that it can be included inside an optimization loop for embedded system design. Us-ing the proposed solution, a temperature-aware reliability optimization, based on the thermal cycling failure mecha-nism, is presented. The experimental results confirm the quality and speed of our SSDTA technique, compared to the state of the art. They also show that the lifetime of an embedded system can significantly be improved, without sacrificing its energy efficiency, by taking into consideration, during the design stage, the steady-state dyna...
Energy consumption has become one of the main design constraints in today’s integrated circuits. Tec...
On-chip power densities continue to increase in modern integrated circuits (IC) due to rapid integra...
Arrays, have resulted in high on-chip power densities, and temperatures. The heterogeneity of compon...
Over the years, thermal-aware designs have become a prominent research issue for real-time applicati...
High computational performance in multiprocessor system-on-chips (MPSoCs) is constrained by the ever...
Abstract—This paper presents modeling and estimation techniques per-mitting the temperature-aware op...
Over the years, thermal-aware designs have become a prominent research issue for real-time applicati...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Thermal-induced reliability issues are receiving an ever increasing attention in modern digital syst...
Energy optimization is one of the most critical objectives for the synthesis of multiprocessor syste...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Abstract—In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power an...
The advent of multi-core platforms in critical realtime domains such as the avionics, automotive and...
This paper presents an approach for the reliability-aware design optimization of real-time systems o...
One major problem for the designer of electronic systems is the presence of uncertainty, which is du...
Energy consumption has become one of the main design constraints in today’s integrated circuits. Tec...
On-chip power densities continue to increase in modern integrated circuits (IC) due to rapid integra...
Arrays, have resulted in high on-chip power densities, and temperatures. The heterogeneity of compon...
Over the years, thermal-aware designs have become a prominent research issue for real-time applicati...
High computational performance in multiprocessor system-on-chips (MPSoCs) is constrained by the ever...
Abstract—This paper presents modeling and estimation techniques per-mitting the temperature-aware op...
Over the years, thermal-aware designs have become a prominent research issue for real-time applicati...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Thermal-induced reliability issues are receiving an ever increasing attention in modern digital syst...
Energy optimization is one of the most critical objectives for the synthesis of multiprocessor syste...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Abstract—In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power an...
The advent of multi-core platforms in critical realtime domains such as the avionics, automotive and...
This paper presents an approach for the reliability-aware design optimization of real-time systems o...
One major problem for the designer of electronic systems is the presence of uncertainty, which is du...
Energy consumption has become one of the main design constraints in today’s integrated circuits. Tec...
On-chip power densities continue to increase in modern integrated circuits (IC) due to rapid integra...
Arrays, have resulted in high on-chip power densities, and temperatures. The heterogeneity of compon...