ed

consuming nanopatterning technique. Thus, developing mold duplication process based on high through-put technique such as nanoimprint lithography can be helpful in reducing its fabrication time and cost. process flexibility and compatibility for biology and chemical applications such as biomolecular patterning and multifunctional microfluidic chips [7]. Among these recent techniques, nanoim-print lithography (NIL) has been demonstrated to be one of the most promising alternative techniques for producing dense peri-odic nanostructures on large areas at reasonable cost [8,9]. With intensive developments from materials (i.e. resists, mold) to fer, whereas the second step is based on soft UV nanoimprint lithography (UV-NIL) associated only with reactive ion etching (RIE). In this paper, we study how each pattern transfer process will affect feature size, pattern shape and homogeneity. Sub-200 nm nanostructures have been inverted with good reproduc-ibility and homogeneity on field as large as 1 cm2. Two successive inversions were finally performed in order to quantify changes in both line width and pattern shape between the original EBL Si mas-ter mold and the grand-daughter Si mold (step 2) replicated from the daughter mold (step 1) by soft UV-NIL