This dissertation presents new signaling schemes and circuit architectures for reducing the power and cost of high-speed chip-to-chip links. After an overview on chip-to-chip inter-connects and its building blocks, a new signaling scheme is proposed that can provide many advantages of a fully-differential signaling scheme while employing as few as N + 1 signal paths for communicating N differential signals. Next, power-efficient signaling schemes that use channel coding to achieve appreciable coding gain are proposed. One discussed method is to use 6-PAM signaling instead of 4-PAM to transmit two bits of information per channel. The proposed low-complexity architecture of this scheme makes its high-speed implementa-tion feasible. A realisti...
Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In t...
Abstract—In this paper, we present some new crosstalk avoid-ance coding schemes devoted to on-chip b...
With technology scaling, size of both transistor and interconnects are reduced. Power dissipation du...
Abstract—This paper describes a new low-power, area and pin efficient alternative to differential en...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
International audienceThis paper introduces a new coding scheme that simultaneously tackles differen...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
International audienceIncreasing memory bandwidth bottleneck, die cost, lower yields at scaled nodes...
As VLSI progresses into Very Deep Submicron (VDSM) realms, global interconnects play an increasingly...
Abstract We propose two crosstalk reducing coding schemes using ternary busses. In addition to low ...
The performance of many digital systems today is limited by the interconnection bandwidth between ch...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
University of Minnesota Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: G...
This thesis tackles the problem of high-speed data communication over wireline channels. Particular...
Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In t...
Abstract—In this paper, we present some new crosstalk avoid-ance coding schemes devoted to on-chip b...
With technology scaling, size of both transistor and interconnects are reduced. Power dissipation du...
Abstract—This paper describes a new low-power, area and pin efficient alternative to differential en...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
International audienceThis paper introduces a new coding scheme that simultaneously tackles differen...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
International audienceIncreasing memory bandwidth bottleneck, die cost, lower yields at scaled nodes...
As VLSI progresses into Very Deep Submicron (VDSM) realms, global interconnects play an increasingly...
Abstract We propose two crosstalk reducing coding schemes using ternary busses. In addition to low ...
The performance of many digital systems today is limited by the interconnection bandwidth between ch...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
University of Minnesota Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: G...
This thesis tackles the problem of high-speed data communication over wireline channels. Particular...
Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In t...
Abstract—In this paper, we present some new crosstalk avoid-ance coding schemes devoted to on-chip b...
With technology scaling, size of both transistor and interconnects are reduced. Power dissipation du...