Devise different DRAM architecture solutions using 3D-Integration technology for improved bandwidth and evaluate the real-time performance in terms of memory efficiency and bandwidth. Proposed architecture We consider a Parallel-Access (PA) method in which each bank of the DRAM has its own command and data interface to the memory controller. This approach is about using the 3D-Integration technology enabler to make banks into independent memories by removing shared logic meant to reduce the number of pins. This increases the provided bandwidth
Abstract—This paper presents an innovative memory management approach to utilize both 3D-DRAM and ex...
Optimal utilization of a multi-channel memory, such as Wide IO DRAM, as shared memory in multi-proce...
Abstract—Memory performance has become the major bottleneck to improve the overall performance of th...
To address the 'memory wall' challenge, on-chip memory stacking has been proposed as a pro...
[[abstract]]To address the “memory wall” challenge, on-chip memory stacking has been proposed as a p...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
MasterIn many-core systems, network size has been increasingly enlarged and they require wider bandw...
Designing memory controllers for complex real-time and high-performance multi-processor systems-on-c...
Historically, processor performance has increased at a much faster rate than that of main memory and...
This paper advocates the use of 3D integration technology to stack a DRAM on top of an FPGA. The DRA...
Abstract—DRAM system has been more and more critical on modern multi-core/many-core architecture whe...
Achieving the main memory (DRAM) required bandwidth at acceptable power levels for current and futur...
Optimal utilization of a multi-channel memory, such as Wide IO DRAM, as shared memory in multi-proce...
This paper advocates the use of 3D integration technology to stack a DRAM on top of an FPGA. The DRA...
none43D integration based on TSV (through silicon via) technology enables stacking of multiple memor...
Abstract—This paper presents an innovative memory management approach to utilize both 3D-DRAM and ex...
Optimal utilization of a multi-channel memory, such as Wide IO DRAM, as shared memory in multi-proce...
Abstract—Memory performance has become the major bottleneck to improve the overall performance of th...
To address the 'memory wall' challenge, on-chip memory stacking has been proposed as a pro...
[[abstract]]To address the “memory wall” challenge, on-chip memory stacking has been proposed as a p...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
MasterIn many-core systems, network size has been increasingly enlarged and they require wider bandw...
Designing memory controllers for complex real-time and high-performance multi-processor systems-on-c...
Historically, processor performance has increased at a much faster rate than that of main memory and...
This paper advocates the use of 3D integration technology to stack a DRAM on top of an FPGA. The DRA...
Abstract—DRAM system has been more and more critical on modern multi-core/many-core architecture whe...
Achieving the main memory (DRAM) required bandwidth at acceptable power levels for current and futur...
Optimal utilization of a multi-channel memory, such as Wide IO DRAM, as shared memory in multi-proce...
This paper advocates the use of 3D integration technology to stack a DRAM on top of an FPGA. The DRA...
none43D integration based on TSV (through silicon via) technology enables stacking of multiple memor...
Abstract—This paper presents an innovative memory management approach to utilize both 3D-DRAM and ex...
Optimal utilization of a multi-channel memory, such as Wide IO DRAM, as shared memory in multi-proce...
Abstract—Memory performance has become the major bottleneck to improve the overall performance of th...