Add to ORKGThree-dimensional stacked Wide I/O DRAMs have been proposed as a promising solution to overcome the pin-limited memory performance growth, the power vs. bandwidth dilemma and the Memory Wall. This new DRAM architecture and organisation requires a new genera-tion of DRAM memory controllers. Virtual platforms enable us to explore the complete de-sign space of memory controllers with an accurate power modelling at the system level with very fast simulation speeds and precise timing accuracy. In this paper, we present a virtual platform based on Synopsys Platform Architect for a fast and precise power estimation o
DRAM scalability is becoming more challenging, pushing the focus of the research community towards a...
International audienceThe ability to perform power estimation early in the design flow is becoming m...
The design of an energy-efficient memory subsystem is one of the key issues that system architects f...
Heterogeneous 3D integrated systems withWide-I/O DRAMs are a promising solution to squeeze more func...
Abstract—JEDEC recently introduced its new standard for 3D- stacked Wide I/O DRAM memories, which de...
Abstract—JEDEC recently introduced its new standard for 3D-stacked Wide I/O DRAM memories, which def...
In embedded systems, extra-functional requirements like power consumption have been increasing in im...
The increased demand on the long battery life of complex SoC systems requires power/energy aware met...
Abstract—In this paper, we propose a virtual platform for power estimation of processor based embedd...
Abstract—Convergence of communication, consumer appli-cations and computing within mobile systems pu...
International audienceIn this paper, we propose a virtual platform for power estimation of processor...
[[abstract]]To address the “memory wall” challenge, on-chip memory stacking has been proposed as a p...
To address the 'memory wall' challenge, on-chip memory stacking has been proposed as a pro...
Energy efficiency is the key driver for the design optimization of System-on-Chips for mobile termi...
In this work, we leverage an open source simulation framework to evaluate different memory schedulin...
DRAM scalability is becoming more challenging, pushing the focus of the research community towards a...
International audienceThe ability to perform power estimation early in the design flow is becoming m...
The design of an energy-efficient memory subsystem is one of the key issues that system architects f...
Heterogeneous 3D integrated systems withWide-I/O DRAMs are a promising solution to squeeze more func...
Abstract—JEDEC recently introduced its new standard for 3D- stacked Wide I/O DRAM memories, which de...
Abstract—JEDEC recently introduced its new standard for 3D-stacked Wide I/O DRAM memories, which def...
In embedded systems, extra-functional requirements like power consumption have been increasing in im...
The increased demand on the long battery life of complex SoC systems requires power/energy aware met...
Abstract—In this paper, we propose a virtual platform for power estimation of processor based embedd...
Abstract—Convergence of communication, consumer appli-cations and computing within mobile systems pu...
International audienceIn this paper, we propose a virtual platform for power estimation of processor...
[[abstract]]To address the “memory wall” challenge, on-chip memory stacking has been proposed as a p...
To address the 'memory wall' challenge, on-chip memory stacking has been proposed as a pro...
Energy efficiency is the key driver for the design optimization of System-on-Chips for mobile termi...
In this work, we leverage an open source simulation framework to evaluate different memory schedulin...
DRAM scalability is becoming more challenging, pushing the focus of the research community towards a...
International audienceThe ability to perform power estimation early in the design flow is becoming m...
The design of an energy-efficient memory subsystem is one of the key issues that system architects f...