Temperature plays an increasingly important role in the over-all performance and reliability of a computing system. Multi-andmany-core systems provide an opportunity tomanage the overall temperature profile by cleverly designing the application-to-core mapping and the associated scheduling policies. An uncontrolled temperature profile may lead to an unplanned performance loss, since the system activates protective mech-anisms such as voltage and/or frequency scaling to cool it-self. Similarly, deep thermal cycles with high frequency lead to severe deterioration in the overall reliability of the system. Design space exploration tools are often used to optimize bind-ing and scheduling choices based on a given set of constraints and objectives...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Catering to society\u27s demand for high performance computing, billions of transistors are now inte...
Performance, power, and temperature are now all first-order design constraints. Balancing power effi...
Power and thermal issues are primary design constraints in both stationary and portable computing de...
Next generation industrial embedded platforms require the development of complex power and thermal m...
Abstract—Multi-core System-on-Chip (SoC) has become a popular execution platform for many embedded r...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Most modern mobile embedded devices have the ability to increase their computational power typically...
The evolution of microprocessors has been hindered by the increasing power consumption and the rate ...
The continuous advance in technology enables the design of more complex embedded systems making use ...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
High computational performance in multiprocessor system-on-chips (MPSoCs) is constrained by the ever...
In modern CMOS integrated Systems-on-Chip global temperature variations arise as well as local fluct...
Temperature aware chip designs have gained importance and popularity in recent years. In this disser...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Catering to society\u27s demand for high performance computing, billions of transistors are now inte...
Performance, power, and temperature are now all first-order design constraints. Balancing power effi...
Power and thermal issues are primary design constraints in both stationary and portable computing de...
Next generation industrial embedded platforms require the development of complex power and thermal m...
Abstract—Multi-core System-on-Chip (SoC) has become a popular execution platform for many embedded r...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Most modern mobile embedded devices have the ability to increase their computational power typically...
The evolution of microprocessors has been hindered by the increasing power consumption and the rate ...
The continuous advance in technology enables the design of more complex embedded systems making use ...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
High computational performance in multiprocessor system-on-chips (MPSoCs) is constrained by the ever...
In modern CMOS integrated Systems-on-Chip global temperature variations arise as well as local fluct...
Temperature aware chip designs have gained importance and popularity in recent years. In this disser...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Catering to society\u27s demand for high performance computing, billions of transistors are now inte...
Performance, power, and temperature are now all first-order design constraints. Balancing power effi...