Parallel molecular dynamics simulations were used to study the influence of pre-existing growth twin boundaries on the slip activity of bulk gold under uniaxial compression. The simulations were performed on a 3D, fully periodic simulation box at 300 K with a constant strain rate of 4×107 s-1. Different twin boundary interspacings from 2 nm to 16 nm were investigated. The strength of bulk nano-twinned gold was found to increase as the twin interspacing was decreased. However, strengthening effects related to the twin size were less significant in bulk gold than in gold nanopillars. The atomic analysis of deformation modes at the twin boundary/slip intersection suggested that the mechanisms of interfacial plasticity in nano-twinned gold were...
Molekulardynamische Simulationen von Kompressionsprüfungen an virtuellen nanoporösen Goldproben, die...
Molecular dynamics simulations are performed to investigate the deformation mechanisms of nanotwinne...
Metallic nanowires show great potential for applications in miniaturization of electronic devices du...
Nanoporous (np) materials are a class of high strength and low density materials that have unique me...
In this study, strain rate effects on the tensile and compressive properties of nano-crystalline nan...
The mechanical properties of Au nanoparticle arrays are studied by tensile and compressive deformati...
The plastic deformation of nanoscale metallic specimens has recently attracted a lot of interest due...
In this study, molecular dynamics simulations were performed to study the uniaxial compression defor...
We present a study of the elastic and plastic behavior of nanoporous gold in compression, focusing o...
In this research parallel molecular dynamics (MD) simulations have been performed to study the defor...
Nanoporous gold (NP-Au) is of great interest to researchers due to its high surface area; and accord...
Nanostructures are emerging as novel materials with revolutionary application in electronics, nuclea...
Metallic nanowires usually exhibit ultrahigh strength but low tensile ductility, owing to their limi...
We report the results of computational tensile and compressive tests for model bi-continuous nanop...
The nanoindentation hardnesses and stacking fault energies (SFE) for pure and alloyed Au are determi...
Molekulardynamische Simulationen von Kompressionsprüfungen an virtuellen nanoporösen Goldproben, die...
Molecular dynamics simulations are performed to investigate the deformation mechanisms of nanotwinne...
Metallic nanowires show great potential for applications in miniaturization of electronic devices du...
Nanoporous (np) materials are a class of high strength and low density materials that have unique me...
In this study, strain rate effects on the tensile and compressive properties of nano-crystalline nan...
The mechanical properties of Au nanoparticle arrays are studied by tensile and compressive deformati...
The plastic deformation of nanoscale metallic specimens has recently attracted a lot of interest due...
In this study, molecular dynamics simulations were performed to study the uniaxial compression defor...
We present a study of the elastic and plastic behavior of nanoporous gold in compression, focusing o...
In this research parallel molecular dynamics (MD) simulations have been performed to study the defor...
Nanoporous gold (NP-Au) is of great interest to researchers due to its high surface area; and accord...
Nanostructures are emerging as novel materials with revolutionary application in electronics, nuclea...
Metallic nanowires usually exhibit ultrahigh strength but low tensile ductility, owing to their limi...
We report the results of computational tensile and compressive tests for model bi-continuous nanop...
The nanoindentation hardnesses and stacking fault energies (SFE) for pure and alloyed Au are determi...
Molekulardynamische Simulationen von Kompressionsprüfungen an virtuellen nanoporösen Goldproben, die...
Molecular dynamics simulations are performed to investigate the deformation mechanisms of nanotwinne...
Metallic nanowires show great potential for applications in miniaturization of electronic devices du...