Abstract—This paper reports on the temperature-dependent electrical resistivity and piezoresistive characteristics of boron-doped ultrananocyrstalline diamond (UNCD) and the fabrication of piezoresistive microcantilevers using boron-doped and undoped UNCD. The devices consist of 1-µm-thick doped UNCD on either 1- or 2-µm-thick undoped UNCD. The electrical resistivity of doped UNCD is 0.1 Ω · cm at room temperature, which is five orders of magnitude smaller than the electrical resistivity of un-doped UNCD. Over the temperature range of 25 ◦C–200 ◦C, the doped UNCD has a temperature coefficient of electrical resistance of (−1.4 × 10−3) per ◦C. The doped UNCD exhibits a significant piezoresistive effect with a gauge factor of 7.53 ± 0.32 and a...
In this work, we present a proof-of-concept for the modulation of field emission currents from boron...
Boron-doped nanocrystalline diamond (NCD:B) elastic layers combined with aluminum nitride (AlN) piez...
MEMS devices are currently fabricated primarily in silicon because of the available surface machinin...
The design, fabrication and test of piezoresistive sensors based on nanocrystalline diamond (NCD) fi...
Tetragonal sp3-bonded diamond has the highest known atomic density. The nature of the bond and its h...
Ultrananocrystalline diamond (UNCD) films are promising for radio frequency micro electro mechanical...
Micro-cantilevers can be used as both sensors and actuators. In this work, the design, fabrication a...
We have characterized mechanical properties of ultrananocrystalline diamond UNCD thin films grown us...
Tetragonal sp3-bonded diamond has the highest known atomic density. The nature of the bond and its h...
For the first time working MEMS resonators have been produced using low-temperature deposited (550◦C...
Micro-cantilevers can be used as both sensors and actuators. In this work, the design, fabrication a...
International audienceThe exceptional chemical, mechanical and thermal properties of diamond make th...
The deposition of diamond films on silicon substrate by MWPECVD is described and microstructural cha...
Thesis (Ph.D.)--Boston UniversityPLEASE NOTE: Boston University Libraries did not receive an Authori...
AbstractMicro-cantilevers can be used as both sensors and actuators. In this work, the design, fabri...
In this work, we present a proof-of-concept for the modulation of field emission currents from boron...
Boron-doped nanocrystalline diamond (NCD:B) elastic layers combined with aluminum nitride (AlN) piez...
MEMS devices are currently fabricated primarily in silicon because of the available surface machinin...
The design, fabrication and test of piezoresistive sensors based on nanocrystalline diamond (NCD) fi...
Tetragonal sp3-bonded diamond has the highest known atomic density. The nature of the bond and its h...
Ultrananocrystalline diamond (UNCD) films are promising for radio frequency micro electro mechanical...
Micro-cantilevers can be used as both sensors and actuators. In this work, the design, fabrication a...
We have characterized mechanical properties of ultrananocrystalline diamond UNCD thin films grown us...
Tetragonal sp3-bonded diamond has the highest known atomic density. The nature of the bond and its h...
For the first time working MEMS resonators have been produced using low-temperature deposited (550◦C...
Micro-cantilevers can be used as both sensors and actuators. In this work, the design, fabrication a...
International audienceThe exceptional chemical, mechanical and thermal properties of diamond make th...
The deposition of diamond films on silicon substrate by MWPECVD is described and microstructural cha...
Thesis (Ph.D.)--Boston UniversityPLEASE NOTE: Boston University Libraries did not receive an Authori...
AbstractMicro-cantilevers can be used as both sensors and actuators. In this work, the design, fabri...
In this work, we present a proof-of-concept for the modulation of field emission currents from boron...
Boron-doped nanocrystalline diamond (NCD:B) elastic layers combined with aluminum nitride (AlN) piez...
MEMS devices are currently fabricated primarily in silicon because of the available surface machinin...