Abstract — In this paper, we develop an evaluation framework to assess variability in nanoscale inversion-mode (IM) and junc-tionless (JL) fin field-effect transistors (FinFETs) due to line edge roughness (LER) and random dopant fluctuation (RDF) for both six transistor (6T) static random access memory (SRAM) design and large-scale digital circuits. From a device-level perspective, JL FinFETs are severely impacted by process variations: up to 40 % and 60 % fluctuation in threshold voltage is observed from LER RDF. Conversely, results show that variability-induced shifts and broadening of timing and power in large-scale digital circuits are not significant and can be accommodated in the design budget. However, we find that LER has a large im...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
ABSTRACT Device level variability in silicon double gate lateral Tunnel Field Effect Transistors (TF...
Abstract — One of the key challenges in scaling beyond 10-nm technology node is device-to-device var...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
Replacing the conventional MOSFET architecture with multiple gate structures like the FinFET can imp...
As a result of CMOS scaling, the critical dimension (CD) of integrated circuits has been shrinking. ...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
3D mixed-mode device-circuit simulation is presented to investigate the impact of line edge roughnes...
Abstract—This paper analyzes the impacts of intrinsic process variations and negative bias temperatu...
3-D mixed-mode device-circuit simulation is presented to investigate stochastic mismatch of FinFETs ...
The continued push for microelectronics scaling has driven many changes in modern transistor design,...
none5Parameter variations pose an increasingly challenging threat to the CMOS technology scaling. Am...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
FinFET is a promising architecture for low voltage/low-power applications at and beyond the 32nm tec...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
ABSTRACT Device level variability in silicon double gate lateral Tunnel Field Effect Transistors (TF...
Abstract — One of the key challenges in scaling beyond 10-nm technology node is device-to-device var...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
Replacing the conventional MOSFET architecture with multiple gate structures like the FinFET can imp...
As a result of CMOS scaling, the critical dimension (CD) of integrated circuits has been shrinking. ...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
3D mixed-mode device-circuit simulation is presented to investigate the impact of line edge roughnes...
Abstract—This paper analyzes the impacts of intrinsic process variations and negative bias temperatu...
3-D mixed-mode device-circuit simulation is presented to investigate stochastic mismatch of FinFETs ...
The continued push for microelectronics scaling has driven many changes in modern transistor design,...
none5Parameter variations pose an increasingly challenging threat to the CMOS technology scaling. Am...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
FinFET is a promising architecture for low voltage/low-power applications at and beyond the 32nm tec...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
ABSTRACT Device level variability in silicon double gate lateral Tunnel Field Effect Transistors (TF...
Abstract — One of the key challenges in scaling beyond 10-nm technology node is device-to-device var...