Two-photon laser-induced fluorescence (TALIF) was used to monitor the decay of Cl atom density in the afterglow of an inductively-coupled plasma in pure Cl2 gas. The surface recombination coefficient, γ, at the reactor surfaces (anodized aluminium and alumina window) was deduced from the decay rate several ms into the afterglow when the gas temperature has cooled to the wall temperature, when a simple diffusion model becomes valid. The values obtained vary from 0.05 to 0.15 depending on gas pressure and RF power. The value of γ also increased significantly as the Cl2 flow rate was reduced, which we attribute to the effect of inevitable small air leaks. This is validated by adding a small flow of O2, and found that the addition of 0.5 % O2 t...
The interaction of reactive atomic species with surfaces is a key phenomenon in many plasma processe...
International audienceSilicon etching in Cl2-based plasmas is an important step for the fabrication ...
International audienceand O2 are widely used in semi-conductor fabrication for gate etching and phot...
Comparisons of 2D fluid simulations with experimental measurements of Ar/Cl2 plasmas in a low-pressu...
International audienceSurface-catalyzed recombination of atoms and free radicals play a key role in ...
International audienceA study is undertaken of the loss kinetics of H and Cl atoms in an inductively...
International audienceInductively-coupled radiofrequency plasmas in molecular, electronegative gases...
The kinetics of the recombination of chlorine atoms has been studied in a fast flow system in the pr...
International audienceIn an industrial inductively coupled plasma reactor dedicated to silicon etchi...
International audienceThe recombination of O (3P) atoms on the surface of a Pyrex tube containing a ...
International audienceInductively-coupled plasmas in molecular, electronegative gases are widely use...
Atomic oxygen ground state density is measured in the time afterglow of a pulsed discharge with res...
The interaction of reactive atomic species with surfaces is a key phenomenon in many plasma processe...
International audienceSilicon etching in Cl2-based plasmas is an important step for the fabrication ...
International audienceand O2 are widely used in semi-conductor fabrication for gate etching and phot...
Comparisons of 2D fluid simulations with experimental measurements of Ar/Cl2 plasmas in a low-pressu...
International audienceSurface-catalyzed recombination of atoms and free radicals play a key role in ...
International audienceA study is undertaken of the loss kinetics of H and Cl atoms in an inductively...
International audienceInductively-coupled radiofrequency plasmas in molecular, electronegative gases...
The kinetics of the recombination of chlorine atoms has been studied in a fast flow system in the pr...
International audienceIn an industrial inductively coupled plasma reactor dedicated to silicon etchi...
International audienceThe recombination of O (3P) atoms on the surface of a Pyrex tube containing a ...
International audienceInductively-coupled plasmas in molecular, electronegative gases are widely use...
Atomic oxygen ground state density is measured in the time afterglow of a pulsed discharge with res...
The interaction of reactive atomic species with surfaces is a key phenomenon in many plasma processe...
International audienceSilicon etching in Cl2-based plasmas is an important step for the fabrication ...
International audienceand O2 are widely used in semi-conductor fabrication for gate etching and phot...