Add to ORKGIn this paper, both experimental and modeling works were resorted to analyze the warpage and wire sweep of QFN molded strip. The effect of QFN package size was investigated to provide the relation between warpage and metal to mold compound ratio. Design guideline for optimum metal to mold compound ratio has been obtained. Nonlinear large deformation of finite element analysis has been performed to investigate the effect of die size and mold compound material properties on the warpage and stress induced. Thermal loading was applied to simulate the cooling process after molding stage. For wire sweep analysis, full factorial design is performed by using three factors, i.e. transfer time, transfer force, and two types of mold compound. The deta...
The paper introduces the advantages of FFT mold technology, and presents an analysis of granular com...
Molding, also known as encapsulation in semiconductor industry, is one of the main processes in semi...
Sensor packages have often to be adapted to current customer requirements. Dimensions, interior stru...
In this paper, both experimental and modeling works were resorted to analyze the warpage and wire sw...
In this paper, both experimental and modeling works were resorted to analyze the warpage and wire sw...
Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects ...
Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects ...
One of the latest developments in packaging technology is QFN (Quad Flat Non-lead) package. This pap...
One of the latest developments in packaging technology is QFN (Quad Flat Non-lead) package. This pap...
In order to maximize production rate, an increasing number of electronic packages are manufactured i...
The presence of thermal mismatch between different materials of plastic IC packages was found to cau...
Numerical simulation plays an important role in product design. Its accuracy relays on a detailed de...
This study successfully established a strip warpage simulation model of the flip-chip process and in...
One of the critical issues during assembly manufacturing process of semiconductor quad flat no-leads...
As semiconductor devices continue to advance in terms of having smaller and denser designs, the semi...
The paper introduces the advantages of FFT mold technology, and presents an analysis of granular com...
Molding, also known as encapsulation in semiconductor industry, is one of the main processes in semi...
Sensor packages have often to be adapted to current customer requirements. Dimensions, interior stru...
In this paper, both experimental and modeling works were resorted to analyze the warpage and wire sw...
In this paper, both experimental and modeling works were resorted to analyze the warpage and wire sw...
Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects ...
Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects ...
One of the latest developments in packaging technology is QFN (Quad Flat Non-lead) package. This pap...
One of the latest developments in packaging technology is QFN (Quad Flat Non-lead) package. This pap...
In order to maximize production rate, an increasing number of electronic packages are manufactured i...
The presence of thermal mismatch between different materials of plastic IC packages was found to cau...
Numerical simulation plays an important role in product design. Its accuracy relays on a detailed de...
This study successfully established a strip warpage simulation model of the flip-chip process and in...
One of the critical issues during assembly manufacturing process of semiconductor quad flat no-leads...
As semiconductor devices continue to advance in terms of having smaller and denser designs, the semi...
The paper introduces the advantages of FFT mold technology, and presents an analysis of granular com...
Molding, also known as encapsulation in semiconductor industry, is one of the main processes in semi...
Sensor packages have often to be adapted to current customer requirements. Dimensions, interior stru...