Add to ORKGHigh bonding strengths are obtained for metals and fiber-reinforced organic resin composites with no significant loss in thermo-oxidative stability of the adhesive resin
The A-type polyimide adhesive resin P11B was modified by use of mixed diamines (thio-dianiline and m...
A series of polyimides containing silicone elastomers was synthesized in order to study the effects ...
The invention is a polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhyd...
A process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quan...
Adhesive development is directed towards elevated temperature applications (200-300 C). Because of t...
The aerospace and electronics industries have an ever increasing need for higher performance materia...
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in...
Adhesive based polyimide solutions which are more easily processed than conventional aromatic polyim...
Experimental polyimide resins were developed and evaluated as potential high temperature adhesives f...
High temperature structural resins are required for use on advanced aerospace vehicles as adhesives ...
The detailed characterization of an experimental thermoplastic polyimidesulfone adhesive based on 3,...
As part of an effort to develop tough solvent resistance thermoplastics for potential use as structu...
A copolyimide was prepared by reacting 3,4'-oxydianiline (3,4'-ODA) with a dianhydride blend compris...
A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high te...
Technique for manufacture of graphite composites uses high-char-forming processable polyimide resin ...
The A-type polyimide adhesive resin P11B was modified by use of mixed diamines (thio-dianiline and m...
A series of polyimides containing silicone elastomers was synthesized in order to study the effects ...
The invention is a polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhyd...
A process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quan...
Adhesive development is directed towards elevated temperature applications (200-300 C). Because of t...
The aerospace and electronics industries have an ever increasing need for higher performance materia...
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in...
Adhesive based polyimide solutions which are more easily processed than conventional aromatic polyim...
Experimental polyimide resins were developed and evaluated as potential high temperature adhesives f...
High temperature structural resins are required for use on advanced aerospace vehicles as adhesives ...
The detailed characterization of an experimental thermoplastic polyimidesulfone adhesive based on 3,...
As part of an effort to develop tough solvent resistance thermoplastics for potential use as structu...
A copolyimide was prepared by reacting 3,4'-oxydianiline (3,4'-ODA) with a dianhydride blend compris...
A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high te...
Technique for manufacture of graphite composites uses high-char-forming processable polyimide resin ...
The A-type polyimide adhesive resin P11B was modified by use of mixed diamines (thio-dianiline and m...
A series of polyimides containing silicone elastomers was synthesized in order to study the effects ...
The invention is a polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhyd...