INTERMETALLIC PHASE FORMATION AND THICKNESS OF TIN- ZINC BASED LEAD-FREE SOLDERS

In this study the intermetallic (IMC) thickness of Sn-Pb, Sn-Zn and Sn-Zn-Bi solders on copper (Cu) substrate were measured at different temperatures using reflow methods. Cu6Sn5 intermetallic phase was detected between Sn-Pb solder and Cu substrate. The J-Cu5Zn8 phase was detected between Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. The thickness of the intermetallics increases with temperature. The IMC thickness for Sn-8Zn-3Bi solder is lower than Sn-9Zn solder for all the soldering temperatures, indicating that Bi has suppressed the initial IMC formation