Integration and Packaging of a Macrochip With Silicon Nanophotonic Links

Abstract—The technologies associated with integration and packaging have a significant impact on the overall system. In this paper, we review a silicon photonic “macrochip ” system and its associated packaging that will allow dense wavelength-division multiplexed optical links to be intimately integrated and co-manufactured with the switching electronics. For this to happen, we anticipate a number of integration and packaging advances. Index Terms—CMOS, computing, macrochip, nanophotonics, optical interconnects, routers, silicon photonics, switching, very large scale integration (VLSI). I