Add to ORKGAbstract—In this letter, an easy concept to eliminate the simultaneous switching noise (SSN) in multilayer board is proposed. By using low impedance element can provide a short path to lead noise to ground, called virtual shield. This method could effectively suppress the first mode of the parallel resonance, and the wider-band suppression could be obtained by array short via. It is also proved that the virtual shield concept needs to be placed as the excited source at the same layer. 1
With the increasing gate density, the rising clock frequency, printed circuit board (PCB) level simu...
With the increasing demand for modern digital circuit with fast edge rates and high clock frequencie...
Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from e...
Abstract—We introduce a model of simultaneous switching noise (SSN) coupling between the power/groun...
We introduce a model of simultaneous switching noise (SSN) coupling between the power/ground plane c...
Signal via transition is inevitable in backplane multi-layer board for high density routing. And a s...
The simultaneous switching noise (SSN) in a multilayer power delivery network (PDN) is a critical pr...
Abslme-Powerlground noise excited in a plane cavity can be coupled to neighboring plane cavity throu...
In this paper, we propose a vertical stepped impedance electromagnetic bandgap (VSI-EBG) structure w...
A wideband and compact partial electromagnetic bandgap (PEBG) structure and a corresponding stopband...
In this paper, a new formulation is provided to model the noise coupling between adjacent planes in ...
Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (I...
Large area fills or entire planes constitute the backbone of the power delivery network in multi-lay...
Abstract Power and ground planes in the multilayer printed circuit board exhibits resonance in the f...
The signal via is a heavily utilized interconnection structure in high-density System-on-Package (So...
With the increasing gate density, the rising clock frequency, printed circuit board (PCB) level simu...
With the increasing demand for modern digital circuit with fast edge rates and high clock frequencie...
Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from e...
Abstract—We introduce a model of simultaneous switching noise (SSN) coupling between the power/groun...
We introduce a model of simultaneous switching noise (SSN) coupling between the power/ground plane c...
Signal via transition is inevitable in backplane multi-layer board for high density routing. And a s...
The simultaneous switching noise (SSN) in a multilayer power delivery network (PDN) is a critical pr...
Abslme-Powerlground noise excited in a plane cavity can be coupled to neighboring plane cavity throu...
In this paper, we propose a vertical stepped impedance electromagnetic bandgap (VSI-EBG) structure w...
A wideband and compact partial electromagnetic bandgap (PEBG) structure and a corresponding stopband...
In this paper, a new formulation is provided to model the noise coupling between adjacent planes in ...
Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (I...
Large area fills or entire planes constitute the backbone of the power delivery network in multi-lay...
Abstract Power and ground planes in the multilayer printed circuit board exhibits resonance in the f...
The signal via is a heavily utilized interconnection structure in high-density System-on-Package (So...
With the increasing gate density, the rising clock frequency, printed circuit board (PCB) level simu...
With the increasing demand for modern digital circuit with fast edge rates and high clock frequencie...
Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from e...
