Add to ORKGAbstract—This letter describes the design, fabrication and testing of lateral field emission diodes utilizing the deep reactive ion etch (DRIE). Devices were fabricated on silicon-on-insulator (SOI) wafers of varied thickness, by etching the device silicon in the STS DRIE system in a single mask process. After subsequent oxidation sharpening and oxide removal, diodes were tested on a probing station under vacuum. A typical diode exhibited very high currents on the order of 100 A at 60 V, and turn-on voltage between 35 V and 40 V. The high electron current is emitted in such a diode by multiple sharp tips vertically spaced by 450 nm along the etched sidewall due to the pulsed nature of the DRIE process. I
Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
International audiencetA process based on deep reactive ion etching (DRIE) has been developed and op...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920)Internat...
Advances in material processing such as silicon micromachining are opening the way to vacuum microel...
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)Advances in material pro...
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)Advances in material pro...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
A three step Deep Reactive Ion Etch (DRIE) process is developed to etch trenches of 10 μm wide to a ...
Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of...
Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
International audiencetA process based on deep reactive ion etching (DRIE) has been developed and op...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920)Internat...
Advances in material processing such as silicon micromachining are opening the way to vacuum microel...
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)Advances in material pro...
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)Advances in material pro...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
A three step Deep Reactive Ion Etch (DRIE) process is developed to etch trenches of 10 μm wide to a ...
Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of...
Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
International audiencetA process based on deep reactive ion etching (DRIE) has been developed and op...