Abstract—Increasing number of cores and clock speeds on a smaller chip area implies more heat dissipation and an ever increasing heat density. This increased heat, in turn, leads to higher cooling cost and occurrence of hot spots. Effective use of dynamic voltage and frequency scaling (DVFS) can help us alleviate this problem. But there is an associated execution time penalty which can get amplified in parallel applications. In high performance computing, applications are typically tightly coupled and even a single overloaded core can adversely affect the execution time of the entire application. This makes load balancing of utmost value. In this paper, we outline a temperature aware load balancing scheme, which uses DVFS to keep core tempe...
Abstract — Clock frequency and transistor density increases have resulted in elevated chip temperatu...
Energy efficiency is quickly becoming a first-class design constraint in high-performance computing ...
Increasing power densities and the high cost of low thermal resistance packages and cooling solution...
Meeting power requirements of huge exascale machines of the future would be one major challenge. Our...
Abstract—As we move towards the exascale era, power and energy have become major challenges. Some of...
Abstract—As we move to exascale machines, both peak power and total energy consumption have become p...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
International audienceThe power consumption of the High Performance Computing (HPC) systems is an in...
Temperature and cooling are critical aspects of design in today's and future computing systems. High...
International audienceDespite recent advances in improving the performance of high performance compu...
Power consumption is a very important issue for HPC community, both at the level of one application ...
As power consumption being the first order constraint to build microprocessors, they are required to...
Abstract—In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power an...
With chip temperature being a major hurdle in microprocessor design, techniques to recover the perfo...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Abstract — Clock frequency and transistor density increases have resulted in elevated chip temperatu...
Energy efficiency is quickly becoming a first-class design constraint in high-performance computing ...
Increasing power densities and the high cost of low thermal resistance packages and cooling solution...
Meeting power requirements of huge exascale machines of the future would be one major challenge. Our...
Abstract—As we move towards the exascale era, power and energy have become major challenges. Some of...
Abstract—As we move to exascale machines, both peak power and total energy consumption have become p...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
International audienceThe power consumption of the High Performance Computing (HPC) systems is an in...
Temperature and cooling are critical aspects of design in today's and future computing systems. High...
International audienceDespite recent advances in improving the performance of high performance compu...
Power consumption is a very important issue for HPC community, both at the level of one application ...
As power consumption being the first order constraint to build microprocessors, they are required to...
Abstract—In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power an...
With chip temperature being a major hurdle in microprocessor design, techniques to recover the perfo...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Abstract — Clock frequency and transistor density increases have resulted in elevated chip temperatu...
Energy efficiency is quickly becoming a first-class design constraint in high-performance computing ...
Increasing power densities and the high cost of low thermal resistance packages and cooling solution...