This Account describes a strategy for fabricating multi-component microsystems in which the structures of essentially all of the components are formed in a single step of micromolding. This strategy, which we call “cofabrica-tion”, is an alternative to multilayer microfabrication, in which multiple layers of components are sequentially aligned (“registered”) and deposited on a substrate by photolithog-raphy. Cofabrication has several characteristics that make it an especially useful approach for building multicomponent microsystems. It rapidly and inexpensively generates correctly aligned com-ponents (for example, wires, heaters, magnetic field generators, optical waveguides, and microfluidic channels) over very large surface areas. By avoi...
WO 200122492 A UPAB: 20010704 NOVELTY - The method involves forming a first set of micro-functional ...
Additive manufacturing (AM) technology has been researched and developed for almost three decades. M...
Design and manufacture of next generation intelligent and connected devices is an interdisciplinary...
This Account describes a strategy for fabricating multicomponent microsystems in which the structure...
Many microfabrication techniques are being developed for applications in microelectronics, microsens...
This paper reports a new method for making multi-layer substrates (MLS) for high aspect ratio single...
This paper presents a novel process chain for fabrication of replication masters for serial manufact...
This paper introduces a new microfabrication technique that combines ultraprecision micro machining ...
Researchers have developed techniques for multi-layered fabrication of microfluidic chips which all...
In the 1980’s science and technology have pushed towards miniaturization. In order to interface to t...
An innovative fabrication technique is introduced that is based on multiple-exposure techniques for ...
Abstract: Unlike manufacturing technology for semiconductors and printed circuit boards, the market ...
The techniques of photolithography and vacuum coating have been investigated, primarily as a means o...
Purpose – This paper aims to demonstrate the innovative functionality of additive manufacturing tec...
A component made up of a perfect combination of different materials (most often including homogeneou...
WO 200122492 A UPAB: 20010704 NOVELTY - The method involves forming a first set of micro-functional ...
Additive manufacturing (AM) technology has been researched and developed for almost three decades. M...
Design and manufacture of next generation intelligent and connected devices is an interdisciplinary...
This Account describes a strategy for fabricating multicomponent microsystems in which the structure...
Many microfabrication techniques are being developed for applications in microelectronics, microsens...
This paper reports a new method for making multi-layer substrates (MLS) for high aspect ratio single...
This paper presents a novel process chain for fabrication of replication masters for serial manufact...
This paper introduces a new microfabrication technique that combines ultraprecision micro machining ...
Researchers have developed techniques for multi-layered fabrication of microfluidic chips which all...
In the 1980’s science and technology have pushed towards miniaturization. In order to interface to t...
An innovative fabrication technique is introduced that is based on multiple-exposure techniques for ...
Abstract: Unlike manufacturing technology for semiconductors and printed circuit boards, the market ...
The techniques of photolithography and vacuum coating have been investigated, primarily as a means o...
Purpose – This paper aims to demonstrate the innovative functionality of additive manufacturing tec...
A component made up of a perfect combination of different materials (most often including homogeneou...
WO 200122492 A UPAB: 20010704 NOVELTY - The method involves forming a first set of micro-functional ...
Additive manufacturing (AM) technology has been researched and developed for almost three decades. M...
Design and manufacture of next generation intelligent and connected devices is an interdisciplinary...