Die-stacked DRAM has been proposed for use as a large, high-bandwidth, last-level cache with hundreds or thousands of megabytes of capacity. Not all workloads (or phases) can productively utilize this much cache space, however. Unfortunately, the unused (or under-used) cache continues to consume power due to leakage in the peripheral circuitry and periodic DRAM refresh. Dynamically adjusting the available DRAM cache capacity could largely eliminate this energy overhead. However, the current proposed DRAM cache organization introduces new challenges for dynamic cache resizing. The organization diers from a conventional SRAM cache organization because it places entire cache sets and their tags within a single bank to reduce on-chip area and p...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
In modern (Intel) processors, Last Level Cache (LLC) is divided into multiple slices and an undocume...
Technology projections indicate that static power will become a major concern in future generations ...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Abstract—Recent research advocates large die-stacked DRAM caches in manycore servers to break the me...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
DRAM memory systems require periodic recharging to avoid loss of data from leaky capacitors. These r...
Memory (cache, DRAM, and disk) is in charge of providing data and instructions to a computer\u27s pr...
In this paper, we present Bi-Modal Cache - a flexible stacked DRAM cache organization which simultan...
Recent research advocates large die-stacked DRAM caches in manycore servers to break the memory late...
With the fast increase of the transistors these years, the power consumption of the IC chip also inc...
the tight integration of significant quantities of DRAM with high-performance computation logic. How...
In this paper we propose techniques to dynamically downsize or upsize a cache accompanied by cache s...
Die stacking memory technology can enable gigascale DRAM caches that can operate at 4x-8x higher ban...
IEEE Due to the large storage capacity, high bandwidth and low latency, 3D DRAM is proposed to be th...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
In modern (Intel) processors, Last Level Cache (LLC) is divided into multiple slices and an undocume...
Technology projections indicate that static power will become a major concern in future generations ...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Abstract—Recent research advocates large die-stacked DRAM caches in manycore servers to break the me...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
DRAM memory systems require periodic recharging to avoid loss of data from leaky capacitors. These r...
Memory (cache, DRAM, and disk) is in charge of providing data and instructions to a computer\u27s pr...
In this paper, we present Bi-Modal Cache - a flexible stacked DRAM cache organization which simultan...
Recent research advocates large die-stacked DRAM caches in manycore servers to break the memory late...
With the fast increase of the transistors these years, the power consumption of the IC chip also inc...
the tight integration of significant quantities of DRAM with high-performance computation logic. How...
In this paper we propose techniques to dynamically downsize or upsize a cache accompanied by cache s...
Die stacking memory technology can enable gigascale DRAM caches that can operate at 4x-8x higher ban...
IEEE Due to the large storage capacity, high bandwidth and low latency, 3D DRAM is proposed to be th...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
In modern (Intel) processors, Last Level Cache (LLC) is divided into multiple slices and an undocume...
Technology projections indicate that static power will become a major concern in future generations ...