Many embedded heterogeneous MPSoCs integrate general purpose cores along with special purpose cores. The power states of these cores are usually controlled by an internal hardware controller rather than the central operating sys-tem. In this paper, we propose a thermal management tech-nique which reduces the performance penalty of central ther-mal management by considering these special purpose cores and the performance requirements of the tasks running on them. Our experimental results show that for the workloads with high priority special purpose tasks, our technique can reduce the occurence of thermal violations by at least 3X while improving the weighted execution time by up to 24%
Abstract — Thermal hot spots and temperature gradients on the die need to be minimized to manufactur...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
Abstract—Thermal effects in MPSoCs may cause the violation of timing constraints in real-time system...
Abstract—Thermal effects in MPSoCs may cause the violation of timing constraints in real-time system...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, tim...
ABSTRACT- Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various ...
Abstract—In this paper, we propose PROMETHEUS, a frame-work for proactive temperature aware scheduli...
Abstract—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocess...
This work proposes CAlECs, a clustered scheduling system for MPSoCs subject to thermal and energy co...
As more and more transistors can be integrated on a single chip, the functionalities that traditiona...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
Abstract: The increased complexity and operating frequency in current microprocessors is resulting i...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Abstract — Designing thermal management strategies that reduce the impact of hot spots and on-die te...
Abstract — Thermal hot spots and temperature gradients on the die need to be minimized to manufactur...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
Abstract—Thermal effects in MPSoCs may cause the violation of timing constraints in real-time system...
Abstract—Thermal effects in MPSoCs may cause the violation of timing constraints in real-time system...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, tim...
ABSTRACT- Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various ...
Abstract—In this paper, we propose PROMETHEUS, a frame-work for proactive temperature aware scheduli...
Abstract—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocess...
This work proposes CAlECs, a clustered scheduling system for MPSoCs subject to thermal and energy co...
As more and more transistors can be integrated on a single chip, the functionalities that traditiona...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
Abstract: The increased complexity and operating frequency in current microprocessors is resulting i...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Abstract — Designing thermal management strategies that reduce the impact of hot spots and on-die te...
Abstract — Thermal hot spots and temperature gradients on the die need to be minimized to manufactur...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...