Abstract—As we move to exascale machines, both peak power and total energy consumption have become prominent major challenges. There has been a lot of research on saving machine energy consumption for HPC data centers. However, a significant part of energy consumption for HPC data centers can be attributed to cooling the machine room. We have already shown significant reduction in cooling energy consumption by constrain-ing core temperatures in our previous work. In this work, we strive to save machine energy consumption while constraining core temperatures in order to provide a total energy solution for HPC data centers that saves both machine and cooling energy consumption. Our approach uses Dynamic Voltage and Frequency Scaling (DVFS) to...
Due to the operating costs and failure rates of computing platforms, energy efficiency has become a ...
AbstractObtaining exascale performance is a challenge. Although the technology of today features har...
High power dissipation and on-chip temperature limit performance and affect reliability in modern mi...
Abstract—Increasing number of cores and clock speeds on a smaller chip area implies more heat dissip...
In High Performance Computing, being respectful of the environment is usually secondary compared to ...
Meeting power requirements of huge exascale machines of the future would be one major challenge. Our...
Abstract—As we move towards the exascale era, power and energy have become major challenges. Some of...
The conventional approaches to reduce the energy consumption of high performance computing (HPC) dat...
International audienceDespite recent advances in improving the performance of high performance compu...
As power consumption being the first order constraint to build microprocessors, they are required to...
Power consumption and process variability are two important, interconnected, challenges of future ge...
Abstract—Low power is an important design requirement for HPC systems nowadays. Dynamic voltage and ...
Energy efficiency is quickly becoming a first-class design constraint in high-performance computing ...
There is a consensus that exascale systems should operate within a power envelope of 20MW. Consequen...
Power consumption is a very important issue for HPC community, both at the level of one application ...
Due to the operating costs and failure rates of computing platforms, energy efficiency has become a ...
AbstractObtaining exascale performance is a challenge. Although the technology of today features har...
High power dissipation and on-chip temperature limit performance and affect reliability in modern mi...
Abstract—Increasing number of cores and clock speeds on a smaller chip area implies more heat dissip...
In High Performance Computing, being respectful of the environment is usually secondary compared to ...
Meeting power requirements of huge exascale machines of the future would be one major challenge. Our...
Abstract—As we move towards the exascale era, power and energy have become major challenges. Some of...
The conventional approaches to reduce the energy consumption of high performance computing (HPC) dat...
International audienceDespite recent advances in improving the performance of high performance compu...
As power consumption being the first order constraint to build microprocessors, they are required to...
Power consumption and process variability are two important, interconnected, challenges of future ge...
Abstract—Low power is an important design requirement for HPC systems nowadays. Dynamic voltage and ...
Energy efficiency is quickly becoming a first-class design constraint in high-performance computing ...
There is a consensus that exascale systems should operate within a power envelope of 20MW. Consequen...
Power consumption is a very important issue for HPC community, both at the level of one application ...
Due to the operating costs and failure rates of computing platforms, energy efficiency has become a ...
AbstractObtaining exascale performance is a challenge. Although the technology of today features har...
High power dissipation and on-chip temperature limit performance and affect reliability in modern mi...