Add to ORKGStandard developer solution is mixed with dipropyl carbonate. This reduces swelling in the photosensitive resist and permits application of relatively thick films with minimal pinhole formation and increased line resolution
Several techniques have been proposed to achieve higher resolution from 193 nm optical lithography [...
In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was ...
A method for applying photographic resists to otherwise incompatible substrates, such as a baking en...
Vacuum dehydration of negatively working photoresist eliminates trace contamination of conventional ...
Positive resist coated wafers were Immersed in a dilute alkaline base developer, such as 5:1 AZ351, ...
At the heart of the tremendous advances of optical microlithography are the resists and the people w...
Growth of silicon dioxide on a silicon carbide crystal ensures proper orientation of photoresist mas...
Defects in photolithographic processing account for large yield losses in semiconductor device fabri...
An experiment was run to determine the ability of surfactants to reduce or remove scum produced duri...
Etchant containing chloroplatinous or chloroplatinic acid greatly reduces contact resistance between...
Two approaches to prevent pattern collapse of 45 nm photoresist features were explored to create a p...
Fabrication method for cathode ray tubes uses low-cost siloxane resin formulations. The resins conta...
Photographic production of a small-dot pattern of known geometry on the surface of a substrate for c...
Plastic film is applied to each side of the fabric and the two films are then fused together with co...
Process utilizing specially modified conventional equipment, with changes in process temperature, pr...
Several techniques have been proposed to achieve higher resolution from 193 nm optical lithography [...
In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was ...
A method for applying photographic resists to otherwise incompatible substrates, such as a baking en...
Vacuum dehydration of negatively working photoresist eliminates trace contamination of conventional ...
Positive resist coated wafers were Immersed in a dilute alkaline base developer, such as 5:1 AZ351, ...
At the heart of the tremendous advances of optical microlithography are the resists and the people w...
Growth of silicon dioxide on a silicon carbide crystal ensures proper orientation of photoresist mas...
Defects in photolithographic processing account for large yield losses in semiconductor device fabri...
An experiment was run to determine the ability of surfactants to reduce or remove scum produced duri...
Etchant containing chloroplatinous or chloroplatinic acid greatly reduces contact resistance between...
Two approaches to prevent pattern collapse of 45 nm photoresist features were explored to create a p...
Fabrication method for cathode ray tubes uses low-cost siloxane resin formulations. The resins conta...
Photographic production of a small-dot pattern of known geometry on the surface of a substrate for c...
Plastic film is applied to each side of the fabric and the two films are then fused together with co...
Process utilizing specially modified conventional equipment, with changes in process temperature, pr...
Several techniques have been proposed to achieve higher resolution from 193 nm optical lithography [...
In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was ...
A method for applying photographic resists to otherwise incompatible substrates, such as a baking en...