LEAD FREE SOLDERING ON CONTACT PADS

In this article are presented results from the investigations of some peculiarities in the process of soldering on small topological forms in PCBs. The investigation is dedicated to the surface mount technology and deals with lead contained and lead free solder alloy pastes. Attention is paid on the implementation of contact pads with lead free surface finish. For this purpose are used galvanic deposited coatings and different solders. The results are obtained when using temperature profiles of typical production process at regimes, recommended by the solder paste vendors. In the experiments are implemented specially developed test lay outs and samples, manufactured from PCB material. Predominantly are investigated the processes of solder wetting in atmospheric surrounding