Delamination of Thin Films Using Laser Induced Stress Waves Undergraduate Researcher

A novel dynamic adhesion test is being developed to extract quantitative fracture parameters using laser-induced stress waves. The sample preparation for adhesion tests involves patterning a weak adhesion layer beneath the test film patterns at a specified location. The thin film region above the weak adhesion layer is allowed to debond using a high-amplitude dynamic stress pulse. The energy trapped in the failed portion of the interface is diverted towards thin film delamination. Gold, carbon and octadecyltrichlorosilane (ODTS) weak adhesion layers were patterned using simple microfabrication techniques