Abstract. GaN films are prepared by MOCVD method on a sapphire substrate. The sample is n-type an semiconductor of 0.5 µm thickness and carriers concentration 2.2 × 1019cm–3.Metal contacts are prepared by evaporation of metals on GaN films. I-V characteristics are carried out under vacuum in the temperature rang from 90 to 300 K. There is a departure from the nonlinear behavior of the current to a linear one as temperature increases due to the sample series resistance. The saturation current is found to be 8.3 × 10–7 A at room temperature; then, it increases with temperature. At room temperature, the barrier height at zero- bias and the flat band barrier height are calculated at different temperature and they are found to be 0.66 eV and 0.8...
We report on the formation of thermally stable and low-resistance Ti/Au-based ohmic contacts to n-ty...
The Schottky barrier heights of molybdenum (Mo) on n-GaN were investigated as a function of annealin...
94 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004.In this work, the development ...
Abstract The forward current–voltage (I–V) characteristics of n-GaN films on sapphire substrate are ...
Low resistance Ti/Al/Ni/Au Ohmic contact to (NH(4))(2)S(x) treated n-type GaN has been studied in th...
188 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2002.Various ohmic contact schemes...
The electrical properties of metal contacts on laser-irradiated n-type GaN were investigated using s...
The effects of thermal annealing on the electrical and structural properties of Ni/Au Schottky conta...
In this paper two types of Al/Ti-based Ohmic contacts to Gallium Nitride (GaN) based devices are pre...
The contacts of Ti/Au, Ti/Al/Au, and Ti/Al/Ni/Au films deposited on n-GaN were studied by current-vo...
The thermal stability and electrical characteristics of tantalum-nitrogen alloy Schottky contacts on...
The behavior of an ohmic contact to an implanted Si GaN n-well in the temperature range of 25-300 de...
Current-voltage (I-V) characteristics, contact resistance, and optical transmittance measurements ar...
Les composés III-N, et le Nitrure de Gallium (GaN) en particulier, sont devenus des matériaux semi c...
We have investigated the thermal annealing effects on electrical and structural properties of Au Sch...
We report on the formation of thermally stable and low-resistance Ti/Au-based ohmic contacts to n-ty...
The Schottky barrier heights of molybdenum (Mo) on n-GaN were investigated as a function of annealin...
94 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004.In this work, the development ...
Abstract The forward current–voltage (I–V) characteristics of n-GaN films on sapphire substrate are ...
Low resistance Ti/Al/Ni/Au Ohmic contact to (NH(4))(2)S(x) treated n-type GaN has been studied in th...
188 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2002.Various ohmic contact schemes...
The electrical properties of metal contacts on laser-irradiated n-type GaN were investigated using s...
The effects of thermal annealing on the electrical and structural properties of Ni/Au Schottky conta...
In this paper two types of Al/Ti-based Ohmic contacts to Gallium Nitride (GaN) based devices are pre...
The contacts of Ti/Au, Ti/Al/Au, and Ti/Al/Ni/Au films deposited on n-GaN were studied by current-vo...
The thermal stability and electrical characteristics of tantalum-nitrogen alloy Schottky contacts on...
The behavior of an ohmic contact to an implanted Si GaN n-well in the temperature range of 25-300 de...
Current-voltage (I-V) characteristics, contact resistance, and optical transmittance measurements ar...
Les composés III-N, et le Nitrure de Gallium (GaN) en particulier, sont devenus des matériaux semi c...
We have investigated the thermal annealing effects on electrical and structural properties of Au Sch...
We report on the formation of thermally stable and low-resistance Ti/Au-based ohmic contacts to n-ty...
The Schottky barrier heights of molybdenum (Mo) on n-GaN were investigated as a function of annealin...
94 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004.In this work, the development ...