Abstract—The analysis and simulation of effects induced by intercon-nects become increasingly important as the scale of process technologies steadily shrinks. While most analyses focus on the timing aspects of inter-connects, power consumption is also important. In this paper, the power distribution analysis of interconnects is studied using a reduced-order model. The relation between power consumption and the poles and residues of a transfer function (either exact or approximated) is derived, and a simple yet accurate driver model is developed, allowing power consumption to be computed efficiently. Application of the proposed method to RC networks is demonstrated using a prototype tool. Index Terms—Interconnect, model order reduction, VLSI...
Abstract. We present a simple and accurate model to compute the power dissipated in sub-micron CMOS ...
This paper presents an efficient method to analyze power distribution networks in the time-domain. I...
Abstract — VLSI circuit models are subject to pa-rameter variations due to temperature, geometry, pr...
Abstract: This paper presents state space closed forms and transfer function recursive algorithms fo...
This paper considers the network structure preserving model reduction of power networks with distrib...
Mathematical models of VLSI RLC interconnects typically involve a large number of variables. Direct ...
The exponential shrinking of the feature size, together with the consistent growth of the chip size ...
A computationally efficient, discrete model is presented for transmission line analysis and passive ...
This work will present a method for the efficient description of a large number of independent sourc...
In this paper, models of the input admittance of RC interconnects are discussed in depth to understa...
The trend of increasing operating frequency and decreasing device size is pushing the...
This work will present a method for the efficient description of independent sources in electrical n...
With the advent of high speed interconnects, signal integrity issues resulting from incident electr...
As operating frequency increases and device sizes shrink, the complexity of current state-of-the-art...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
Abstract. We present a simple and accurate model to compute the power dissipated in sub-micron CMOS ...
This paper presents an efficient method to analyze power distribution networks in the time-domain. I...
Abstract — VLSI circuit models are subject to pa-rameter variations due to temperature, geometry, pr...
Abstract: This paper presents state space closed forms and transfer function recursive algorithms fo...
This paper considers the network structure preserving model reduction of power networks with distrib...
Mathematical models of VLSI RLC interconnects typically involve a large number of variables. Direct ...
The exponential shrinking of the feature size, together with the consistent growth of the chip size ...
A computationally efficient, discrete model is presented for transmission line analysis and passive ...
This work will present a method for the efficient description of a large number of independent sourc...
In this paper, models of the input admittance of RC interconnects are discussed in depth to understa...
The trend of increasing operating frequency and decreasing device size is pushing the...
This work will present a method for the efficient description of independent sources in electrical n...
With the advent of high speed interconnects, signal integrity issues resulting from incident electr...
As operating frequency increases and device sizes shrink, the complexity of current state-of-the-art...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
Abstract. We present a simple and accurate model to compute the power dissipated in sub-micron CMOS ...
This paper presents an efficient method to analyze power distribution networks in the time-domain. I...
Abstract — VLSI circuit models are subject to pa-rameter variations due to temperature, geometry, pr...