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The possible applications for micro-bubble powered devices are abundant and the potential of using the phase change process to solve the heat dissipation problem in IC industry is enormous. Therefore, it is important to investigate the fundamental mecha-nisms of bubble nucleation in the micro-scale. Among the demonstrated devices using thermal bubbles, they can be classified into two groups according the devices structures. In the case of open environment, there is ink-jet printer head @3#. In the case of close environment, there are micro-thermal bubble pump