WAVE SOLDERING QUALITY IMPROVEMENT BY DESIGN OF EXPERIMENT APPROACH

The investigation deals with quality improvement of wave soldering joints for printed circuit boards (PCB) by using DOE approach. Using DOE pro XL capabilities, DOE and statistic process control an effective way to approach and evaluate wave soldering process development is offered to determine the most essential control parameters in order to achieve the optimum process set-up for individual application. An example was given to show the procedure and results in using our investigations. The goal in the presented experiment was to reduce greatly the solder connection defects as bridges and poor soldering elements