A new accurate method for simulation of the device that is subjected to low-dose high-energy ion irradiation (hydrogen, helium) is compared with the ordinary simulation technique which utilizes a structured lifetime profile as an input into SRH recombination model. The novel method, involving ion-implantation process simulator, expert system, and multilevel recombination model is described. Spatial distribution of the minority carrier lifetime of irradiated device is drawn for different injection levels. Simulated trade-off between forward voltage drop and reverse recovery time is presented for both the hydrogen and helium irradiation. 1
A numerically efficient model for the simulation of ion implantation doping profiles in silicon afte...
A new damage model for ion implantation simulation based on molecular dynamic method is introduced i...
Quantitatively accurate simulation of HeZ+ irradiated power diode was achieved. The results have sho...
Recent studies suggest that lattice damage induced by helium or proton ion implantation can be used ...
The distribution of recombination centers induced in Si epi-substrates by helium (He) implantation ...
Ion implantation is the most important doping technique for VLSI circuits. In this contribution, mod...
The project is directed to the study and to the characterization of the most advanced lifetime contr...
The effect of dose on range profiles of medium and low energy ion implantation used in formation of ...
Defects evolution in silicon during annealing after low energy Si+ implantation is simulated by atom...
New method of carrier lifetime measurement is proposed for accurate power device simulation which re...
The activation efficiency of implanted Si in LEC grown GaAs has been investigated experimental ly. A...
In this paper, a model of helium ion implanted monocrystalline Si was constructed by using molecular...
The effect of lifetime engineering processes on the electrical behaviour of electronic devices is re...
About 10 MeV helium and 120 MeV neon implantations were used for the local lifetime control of silic...
Classical molecular dynamics simulations are used to study damage produced during implantation of se...
A numerically efficient model for the simulation of ion implantation doping profiles in silicon afte...
A new damage model for ion implantation simulation based on molecular dynamic method is introduced i...
Quantitatively accurate simulation of HeZ+ irradiated power diode was achieved. The results have sho...
Recent studies suggest that lattice damage induced by helium or proton ion implantation can be used ...
The distribution of recombination centers induced in Si epi-substrates by helium (He) implantation ...
Ion implantation is the most important doping technique for VLSI circuits. In this contribution, mod...
The project is directed to the study and to the characterization of the most advanced lifetime contr...
The effect of dose on range profiles of medium and low energy ion implantation used in formation of ...
Defects evolution in silicon during annealing after low energy Si+ implantation is simulated by atom...
New method of carrier lifetime measurement is proposed for accurate power device simulation which re...
The activation efficiency of implanted Si in LEC grown GaAs has been investigated experimental ly. A...
In this paper, a model of helium ion implanted monocrystalline Si was constructed by using molecular...
The effect of lifetime engineering processes on the electrical behaviour of electronic devices is re...
About 10 MeV helium and 120 MeV neon implantations were used for the local lifetime control of silic...
Classical molecular dynamics simulations are used to study damage produced during implantation of se...
A numerically efficient model for the simulation of ion implantation doping profiles in silicon afte...
A new damage model for ion implantation simulation based on molecular dynamic method is introduced i...
Quantitatively accurate simulation of HeZ+ irradiated power diode was achieved. The results have sho...