ON A POSSIBILITY FOR COMMUNICATION AND COMPUTING DEVICES EMI SHIELDING

Abstract. Recently many international terrorist groups can actively plan coordinated attacks against both military and space computer and telecommunication systems and civilian critical infrastructures (such as Supervisory Control and Data Acquisition Systems), using high level electromagnetic field techniques. Because the electromagnetic interference (EMI) shielding activities play the major role for the prevention of the damages, disrupt equipment operations, change processing control, or corrupt stored data. High energy electromagnetic fields with a large frequency range, different duration and intensity can overload circuit boards, transistors, and other electronics, as well as they can erase electronic memory, upset software, or permanently disable all electronic components. Defense and Security Sector leaders plan different strategies in the three directions: ONP (Open Network Provision), Satellite Telecommunication (ST) and Mobile Telecommunication Systems (MTS). All of these directions include the protection against non-authorized accesses to the data bases and voice transmissions, which can implement via a interception of own frequencies as well as the protection against directed electromagnetic hazardous flows. The present paper reports some results concerning scientific investigations, testing and industrial incorporation of a easy accessible, inexpensive, high efficiently and reliable method for EMI shielding – electrochemical deposition of amorphous metal alloys layers onto both outer surfaces of the products boxes and surfaces of the inner interposed modules, independently of their materials- plastics, aluminum alloys or ferrous metals. These advantages allow the method to be high competitive, compared to the other methods, and draw its future development and multiplication. І