Abstract—Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D system. In multicore systems, workload varies at runtime, and the system is generally not fully utilized. Thus, it is not energy-efficient to adjust the coolant flow rate based on the worst-case conditions, as this would cause an excess in pump power. For energy-efficient cooling, we propose a novel controller to adjust the liquid flow rate to meet the desired temperature and to minimize pump energy consumption. Our technique also includes a job scheduler, which balances the temperatu...
Hot-water liquid cooling is a key technology in future green supercomputers as it maximizes the cool...
Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurr...
The performance improvement of today's computer systems is usually accompanied by increased chip pow...
International audience3D stacked architectures are getting increasingly attractive as they improve y...
Abstract — Three-dimensional (3D) circuits reduce communication de-lay in multicore SoCs, and enable...
Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it pro...
3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and a...
Abstract — 3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MP...
Abstract—3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enab...
3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable ...
In this work, we propose a novel online thermal management approach based on model predictive contro...
Microchannel liquid cooling shows great potential in cooling 3D processors. However, the cooling of ...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the b...
Rising chip temperatures and aggravated thermal reliability issues have characterized the emergence ...
Hot-water liquid cooling is a key technology in future green supercomputers as it maximizes the cool...
Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurr...
The performance improvement of today's computer systems is usually accompanied by increased chip pow...
International audience3D stacked architectures are getting increasingly attractive as they improve y...
Abstract — Three-dimensional (3D) circuits reduce communication de-lay in multicore SoCs, and enable...
Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it pro...
3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and a...
Abstract — 3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MP...
Abstract—3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enab...
3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable ...
In this work, we propose a novel online thermal management approach based on model predictive contro...
Microchannel liquid cooling shows great potential in cooling 3D processors. However, the cooling of ...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the b...
Rising chip temperatures and aggravated thermal reliability issues have characterized the emergence ...
Hot-water liquid cooling is a key technology in future green supercomputers as it maximizes the cool...
Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurr...
The performance improvement of today's computer systems is usually accompanied by increased chip pow...