Add to ORKGAbstract — We have fabricated an LUT-based FPGA device with functionalities measuring within-die variations in a 90nm process. Measured variations are used to configure each device to maximize the operating frequency by allocating critical paths in faster portions. Variations are measured using ring oscillators im-plemented as a configuration of the FPGA. Placement optimiza-tion using a simple model circuit reveals that performance of the circuit is enhanced by 4 % in average, which is the same amount as the measured within-die variations. The yield is enhanced by 32 % to the worst case. I
Process variability is a challenging fabrication issue impacting, mainly, the reliability and perfor...
ABSTRACT Chip design in the nanometer regime is becoming increasingly difficult due to process varia...
During the design of embedded systems, many design decisions have to be made to trade off between co...
A reconfiguralbe device can be utilized to enhance speed and yield on the sub-100nm device technolog...
Abstract — It is possible to enhance speed and yield of reconfigurable devices utilizing WID variati...
The mitigation of process variability becomes paramount as chip fabrication advances deeper into the...
As processor clock frequencies become faster, architecture-level design is becoming increasingly lim...
Both random and systematic within-die process variations (PV) are growing more severe with shrinking...
Abstract—As semiconductor manufacturing continues towards reduced feature sizes, yield loss due to p...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Compute...
Electronic monitoring utilizing process-specific Ring Oscillators (RO) is explored as a means of ide...
Continued miniaturization of semiconductor technology to nanoscale dimensions has elevated reliabili...
We report the design and characterization of a circuit technique to measure the on-chip delay of a...
iii As feature sizes scale toward atomic limits, parameter variation continues to increase, leading ...
Chip design in the nanometer regime is becoming increasingly difficult due to process variations. AS...
Process variability is a challenging fabrication issue impacting, mainly, the reliability and perfor...
ABSTRACT Chip design in the nanometer regime is becoming increasingly difficult due to process varia...
During the design of embedded systems, many design decisions have to be made to trade off between co...
A reconfiguralbe device can be utilized to enhance speed and yield on the sub-100nm device technolog...
Abstract — It is possible to enhance speed and yield of reconfigurable devices utilizing WID variati...
The mitigation of process variability becomes paramount as chip fabrication advances deeper into the...
As processor clock frequencies become faster, architecture-level design is becoming increasingly lim...
Both random and systematic within-die process variations (PV) are growing more severe with shrinking...
Abstract—As semiconductor manufacturing continues towards reduced feature sizes, yield loss due to p...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Compute...
Electronic monitoring utilizing process-specific Ring Oscillators (RO) is explored as a means of ide...
Continued miniaturization of semiconductor technology to nanoscale dimensions has elevated reliabili...
We report the design and characterization of a circuit technique to measure the on-chip delay of a...
iii As feature sizes scale toward atomic limits, parameter variation continues to increase, leading ...
Chip design in the nanometer regime is becoming increasingly difficult due to process variations. AS...
Process variability is a challenging fabrication issue impacting, mainly, the reliability and perfor...
ABSTRACT Chip design in the nanometer regime is becoming increasingly difficult due to process varia...
During the design of embedded systems, many design decisions have to be made to trade off between co...